Indium Corporation® will feature its high-reliability, Au-based precision die-attach (PDA) preforms for critical laser and RF applications at the International Microwave Symposium, Denver, Colo., June 19–24.

Indium Corporation is the leading solder supplier for laser, optical, and RF microwave applications. Au-based alloys are a great choice to ensure the best performance and reliability possible for applications requiring a high-melting die-attach solder. In addition to meeting the demanding thermal and electrical requirements for high-reliability applications, they also provide the strongest corrosion- and oxidation-resistant solder joint possible. Semiconductor laser and RF power die-attach applications require the highest quality, ultraprecise solder preforms to ensure accuracy and repeatability during assembly for a guaranteed highly-reliable end product. Indium Corporation’s Au-based PDA preforms offer the highest level of quality available to deliver the best performance possible in critical, high-reliability die-attach applications. Features include:

• Highly accurate thickness control

• Precision edge quality, virtually burr-free

• Optimized cleanliness control

• Default waffle-pack method

Indium Corporation’s AuLTRA™ 75 is an off-eutectic AuSn preform solution (75Au25Sn) designed to improve intermetallic reliability in applications using a die with a thicker gold plating, such as a GaN die used for high-frequency, high-power RF power amplifier devices for 5G and other critical military and aerospace wireless communications. AuLTRA™ 75 helps improve the operation of these critical technologies by offering a lower gold content, allowing for the absorption of gold from the die, and thereby ensuring a strong solder bond.

AuSn preform solutions:

• Deliver improved wetting and voiding

• Allow for adjustment of the final solder joint composition

• Are available in 78Au22Sn and 79Au21Sn formulations

Indium Corporation’s AuLTRA™ ThInFORMS™ are 0.00035” thick (0.00889mm or 8.89μm) 80Au20Sn preforms that improve the overall operational efficiency of high-output lasers. AuLTRA™ ThInFORMS™ help combat common issues such as:

• Shorting—reduced solder volume inhibits wicking up the die, minimizing the risk of shorting

• Poor thermal transfer—the ultra-thin 0.00035” preform reduces bondline thickness, thus improving thermal transfer and increasing the longevity and performance of the device.

To learn more about Indium Corporation’s precision Au-based preforms, visit www.indium.com/products/solders/gold/gold-preforms or stop by booth #9012 at the show.

About Indium Corporation

Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.

For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/ or @IndiumCorp.

(South Plainfield, NJ USA) – May 4, 2022 – MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions, will showcase its latest sintering process solutions, including the new ALPHA Argomax AccuLam Sintering Film, at the upcoming PCIM exhibition in Nuremberg, Germany from Tuesday 10th - Thursday 12th May in Hall 7 Booth #227.

ALPHA Argomax AccuLam is the next revolution in Sintering Film, delivering higher throughput and larger area lamination compatibility whilst being uniquely customized for a customer’s requirements. The film is part of the range of ALPHA Argomax Sinter Process Solutions which also includes paste for printing and dispense and preforms specially engineered for Top Side Attach, Die Attach, Wafer Attach and Package Attach processes.

A key highlight at the MacDermid Alpha booth will be demonstrations of ALPHA Argomax in the package attach process using a sintering press. The successful sintering of molded power packages is possible due to the lower pressure, lower temperature, and faster sinter times enabled by ALPHA Argomax. The paste ensures intimate contact between the package and the heat-sink, accommodates warpage, and sinters with low pressure without cracking the molded module. ALPHA Argomax, based on proprietary nano-particles technology, is the preferred sintering solution for package to heat-sink attach with demonstrated 10X improvement in power cycling reliability.

To register for PCIM Europe please visit: https://pcim.mesago.com/nuernberg/en.html

For more information on ALPHA Argomax AccuLam and the ALPHA Argomax range of Sintering Process Solutions please visit: macdermidalpha.com

About MacDermid Alpha Electronics Solutions:

Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, Electrolube, Kester, and MacDermid Enthone brands, MacDermid Alpha Electronics Solutions provides solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Assembly Solutions, Semiconductor Solutions, and Circuitry Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time.

Irvine, California, USA - Martin Hart, CEO of TopLine® Corporation, will present “Achilles Heel in the RadHard FPGA Supply Chain” at Space Tech Expo USA in Long Beach, California, May 24, 2022. Hart is a widely-known authority and product developer in the field of electronic components technology and a holder of multiple U.S. Patents. “Today, 90% of chip makers rely on a single hardware subcontractor to attach solder columns to space grade Radiation Hardened FPGA and Application Specific (ASIC) chips,” Hart says. “This is a recipe for disaster.”

In addition to Martin’s oral presentation, TopLine will also exhibit Solder Columns in booth #4014. TopLine recently announced the availability of new low-void solder columns, developed by TopLine engineers using new proprietary processes. The absence of voids in the column's high temperature core makes the columns structurally stronger and more reliable.

Space Tech Expo USA is considered to be the West Coast’s must-attend B2B exhibition and conference for space technology and services. Now in its 10th edition, Space Tech Expo USA returns to Long Beach, California, May 23 -25. For more information about the show, visit https://www.spacetechexpo.com/.

About TopLine

TopLine manufactures a wide range of solder columns for CCGA semiconductor packages, and provides Daisy Chain CCGA packages for engineering development, profiling and practice. TopLine products provide hands-on learning for engineers. To learn more, visit www.CCGA.tv or call (1+) 800 – 776-9888.

MEDINA, MINNESOTA ― May 2022 ― ASC International, a leading manufacturer of 3-D solder paste inspection (SPI) and automated optical inspection (AOI) systems, is pleased to offer the LaserVision SP3D Mini 3D Solder Paste Inspection system. The system offers the same level of overall measurement capabilities as the VisionPro SP3D, but utilizes a lower cost microscope platform and the ability for customers to supply their own PC if needed. The SP3D Mini sets the affordable boundary on reliable, low-cost SPI solutions.

The LaserVision SP3D Mini provides a powerful alternative to visual inspection of solder paste deposits, automatically calculating and storing critical printing characteristics in one click. The system enables ASC International to offer the same remarkable SPI technology found in their VisionPro and VisionPro AP Series models, but in an entry-level instrument. This makes LaserVision SP3D Mini ideal for manufacturers striving for better process control of the paste printing process, but working with a limited budget.

The SP3D Mini’s optional laser scanning feature provides 3D profiling capabilities along with added accuracy and repeatability due to increased data acquisition. This feature also provides a second layer of analysis to establish proper corrective actions based upon qualitative defect attributes.

For more information about ASC International, visit www.ascinternational.com.