Cranston, Rhode Island USA – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce their participation in the upcoming SMTA Long Island Expo taking place on October 19th at the Marriott Melville in Melville, New York. AIM will highlight V9, their new ultra-low-voiding, no clean paste, along with their full line of solder assembly materials.

Formulated to solve one of the industry’s most difficult challenges, V9 has proven to reduce voiding to as low as 1% on BGA and <5% on BTC components while exhibiting stable print performance on fine feature devices over 12 hours. V9 post-process residue is easily probed and possesses high SIR values required for high reliability applications.

To discover all of AIM’s products and services, visit the company at the SMTA Long Island Expo on October 19th for more information and to speak with one of AIM’s knowledgeable staff members, or visit www.aimsolder.com.

About AIM

Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service, and training. For more information about AIM’s complete line of advanced solder products and global technical services, please visit www.aimsolder.com.

(Waterbury, CT USA) – October 6th, 2022 - MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions, will present the technical paper: “Automotive Traction Module Attach by Silver Sintering - Process, Performance & Reliability” at the 39th International Electronics Manufacturing Technology (IEMT) Conference from October 19 - 21 in Putrajaya, Malaysia.

Gyan Dutt, Strategic Marketing Manager at MacDermid Alpha, will discuss the recent emergence of pressure sintered silver as the die attach material of choice over solder for power devices, especially in electric vehicle traction modules. This has led to overall inverter reliability shifting to heat sink level and triggered active investigations of silver sintering for module to heat-sink adoption. The paper will introduce the module sintering attach process with STPAK™, an advanced SiC discrete package from STMicroelectronics and its STPOWER portfolio. The presentation will showcase this high-power density, yet modular design approach for assembling next generation EV traction inverters with automotive qualified and commercially available STPAKs and silver sintering.

The ALPHA® Argomax® range of silver sinter products are designed to provide customers with superior performance for today’s stringent reliability requirements. ALPHA Argomax products offer a complete solution providing best process times and reliability and flexible, easy-to-use form factors that reduce total cost of ownership and time to market, ushering in a new era of high-performance materials.

Gyan Dutt will present the paper at 10:55 am on Thursday, October 20th in Le Méridien Putrajaya. Visit the MacDermid Alpha tabletop during the conference to discuss our range of ALPHA Argomax silver sinter products and solutions for power electronics applications.

To learn more about MacDermid Alpha’s vast product offering and capabilities, please visit MacDermidAlpha.com

39th International Electronics Manufacturing Technology

Topic: Automotive Traction Module Attach by Silver Sintering - Process, Performance & Reliability

Speaker: Gyan Dutt, Strategic Marketing Manager

Date/time: October 20th (Thu) / 10:55-11:20

Venue: Level 2, Gallery 8, Le Méridien Putrajaya

About MacDermid Alpha Electronics Solutions:

Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, Electrolube, Kester, and MacDermid Enthone brands, MacDermid Alpha Electronics Solutions provides solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time.

(Waterbury, CT USA) – October 6th, 2022 - MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions, will present the technical paper: “Automotive Traction Module Attach by Silver Sintering - Process, Performance & Reliability” at the 39th International Electronics Manufacturing Technology (IEMT) Conference from October 19 - 21 in Putrajaya, Malaysia.

Gyan Dutt, Strategic Marketing Manager at MacDermid Alpha, will discuss the recent emergence of pressure sintered silver as the die attach material of choice over solder for power devices, especially in electric vehicle traction modules. This has led to overall inverter reliability shifting to heat sink level and triggered active investigations of silver sintering for module to heat-sink adoption. The paper will introduce the module sintering attach process with STPAK™, an advanced SiC discrete package from STMicroelectronics and its STPOWER portfolio. The presentation will showcase this high-power density, yet modular design approach for assembling next generation EV traction inverters with automotive qualified and commercially available STPAKs and silver sintering.

The ALPHA® Argomax® range of silver sinter products are designed to provide customers with superior performance for today’s stringent reliability requirements. ALPHA Argomax products offer a complete solution providing best process times and reliability and flexible, easy-to-use form factors that reduce total cost of ownership and time to market, ushering in a new era of high-performance materials.

Gyan Dutt will present the paper at 10:55 am on Thursday, October 20th in Le Méridien Putrajaya. Visit the MacDermid Alpha tabletop during the conference to discuss our range of ALPHA Argomax silver sinter products and solutions for power electronics applications.

To learn more about MacDermid Alpha’s vast product offering and capabilities, please visit MacDermidAlpha.com

39th International Electronics Manufacturing Technology

Topic: Automotive Traction Module Attach by Silver Sintering - Process, Performance & Reliability

Speaker: Gyan Dutt, Strategic Marketing Manager

Date/time: October 20th (Thu) / 10:55-11:20

Venue: Level 2, Gallery 8, Le Méridien Putrajaya

About MacDermid Alpha Electronics Solutions:

Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, Electrolube, Kester, and MacDermid Enthone brands, MacDermid Alpha Electronics Solutions provides solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time.

TEMPE, Ariz., Oct. 6, 2022 /PRNewswire/ -- Benchmark Electronics, Inc. (NYSE: BHE), a global provider of engineering, design, and manufacturing services, today announced it is partnering with Yield Engineering Systems (YES) to transfer the manufacturing of the YES flagship product line to its facility in Malaysia, as well as providing engineering and manufacturing support for YES's upcoming innovative modular wet process systems in the Phoenix, Arizona area.

Benchmark Electronics (PRNewsfoto/Benchmark Electronics, Inc.) "We have developed a strong partnership with Benchmark built on trust and our combined expertise," said Ramakanth Alapati, Chief Executive Officer of YES. "We look forward to working closely with the team to bring our technology to a wider market, and to further expanding our footprint in the semiconductor capital equipment industry as the need for semiconductor manufacturing support continues to grow worldwide."

YES is at the leading edge of material modification and surface enhancement solutions. The company's patented technologies significantly enhance the speed, reliability, and cost-effectiveness of semiconductor production processes. YES's thermal, deposition, and wet process systems provide critical technology to semiconductor, life science, and display manufacturers large and small as they work to meet the demand for semiconductors, genomics, point of care diagnostics, and innovative displays.

Benchmark's Phoenix operation will be leveraging the company's deep expertise in the semiconductor capital equipment market, including mechatronic engineering, precision machining, and sub-system assembly. The partnership comes at a critical time as the CHIPS Act has created a flurry of activity around the semiconductor industry and demand for organizations supporting the industry has risen dramatically.

"YES is helping solve critical problems for their customers in the fast-growing semiconductor manufacturing industry," said Jeff Benck, president and CEO, Benchmark. "We're proud to be selected as their strategic partner and look forward to working hand-in-hand with their team to help bring their technology to market to meet the demand for semiconductor capital equipment."

To learn more about Benchmark's services and capabilities in semiconductor capital equipment, please visit the website at www.bench.com.

About Benchmark Electronics, Inc.

Benchmark provides comprehensive solutions across the entire product life cycle; leading through its innovative technology and engineering design services; leveraging its optimized global supply chain; and delivering world-class manufacturing services in the following industries: commercial aerospace, defense, advanced computing, next-generation telecommunications, medical, complex industrials, and semiconductor capital equipment. Benchmark's global operations include facilities in seven countries and its common shares trade on the New York Stock Exchange under the symbol BHE.

About Yield Engineering Systems, Inc. (YES)

Yield Engineering Systems, Inc. (YES) is a preferred provider of high-tech, cost-effective equipment for enhancing surfaces and materials. The company's product lines include thermal processing systems, chemical vapor deposition (CVD) systems, and wet process equipment used for the precise surface modification of semiconductor substrates, semiconductor and MEMS devices, LED displays, and bio-devices. Customers ranging from startups to Fortune 100 companies rely on YES systems to create and volume-produce innovative products in a wide range of markets. YES is headquartered in Fremont, California, with a growing global presence. For more information, please visit yieldengineering.com.