Indium Corporation Senior Global Product Manager for Semiconductor and Advanced Materials, Sze Pei Lim, will be part of a panel presentation at the International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) conference in Taipei, Taiwan on Oct. 27. The presentation will cover the findings from a technical paper titled The Effects of Voids on Solder Joint Reliability in First Level Interconnect.

First level interconnect (FLI), e.g., flip-chip attach on substrate or wafer, using solder as the interconnect material, is employed extensively in advanced packaging assembly. During the flip-chip die-attach process, some voids are often formed in the solder joints. In the past, this may not have been seen as a major issue since the voiding percentage is typically less than 10%; however, as miniaturization continues, the solder joint of FLI is becoming smaller (<100µm bump or Cu pillar size) with tighter pitch and higher density, there is an increasing concern with how the micro voids in the solder joint will affect the package’s long-term reliability even though the void percentage is not excessive. This paper will describe the details of the different test conditions, and discuss observations from the failure analysis done with cross-sections and electron backscatter diffraction (EBSD) analysis.

As Senior Global Product Manager for Semiconductor and Advanced Materials, Lim works closely with R&D and manufacturing, and engages with the world’s leading semiconductor companies and contract manufacturers. She is a task force member of the International Electronics Manufacturing Initiative (iNEMI) Packaging Technology Integration Group and has co-chaired a number of industry projects and road-mapping initiatives over the past five years. She is also on the executive committee of the Institute of Electrical and Electronics Engineers (IEEE) Packaging Society, Malaysia Chapter. Lim is a part of the organizing committee for the International Electronics Manufacturing Technology (IEMT). She has authored a number of technical papers and presented regularly in various international technical conferences. She holds a bachelor’s degree from the National University of Singapore, where she majored in industrial chemistry with a focus in polymers. She is a Certified SMT Process Engineer and has earned her Six Sigma Green Belt designation.

About Indium Corporation

Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.

For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/ or @IndiumCorp.

Tokyo, Japan – Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, has been chosen for Infineon’s ‘High Power Equipment Supplier’ award. Saki’s X-ray inspection machines are a key system for quality control in Infineon’s manufacture of insulated gate bipolar transistor (IGBT) power modules, and it is honored to receive this award in acknowledgement of the exceptional logistics and performance work achieved in this ongoing partnership.

With its AXI central to Infineon’s inspection process and quality assurance, Saki is pleased to receive this annual award, reflecting the dedication of its team as well as the reliability of the hardware itself.

Saki was delighted to attend Infineon’s event and ceremony in Kuala Lumpur to receive the recognition of its work. There, Eddie Ichiyama, Saki’s Chief Sales Manager - Overseas, accepted the award, saying, “It is an honor to receive Infineon’s award for our continued improvements in the field of power semiconductor manufacture. Saki has advanced the technology in the essential arena of quality assurance and inspection, and is proud to be recognized with this award.”

For further information about Saki, visit www.sakicorp.com/en/.

Newman Lake, WA – Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that AEM Incorporated has purchased a Pulsar solderability system.

The Pulsar utilizes the highly proven dip-and-look test method that is a qualitative type test performed by comparative analysis after specimens are dipped in a bath of flux and molten solder. An advantage of the dip-and-look method is since it is based on comparative analysis it can be performed rapidly by shop floor personnel with minimal training as well as requiring significantly lower capital investment then a wetting balance test system.

The Pulsar solderability test system complies with all applicable solderability test standards including MIL-STD-883 Method 2003, IPC J-STD-002 and MIL-STD-202 Method 208.

About AEM Incorporated

Headquartered in San Diego, California, AEM Incorporated manufacturers hi-reliability fuses, hi- reliability ferrite devices and tin whisker mitigation services for demanding applications. Their core technologies, quality assurance and MIL certified quality control testing laboratory assures complete environment stress screening and product traceability. For more information, please visit: www.aem-usa.com.

About Hentec Industries

Hentec Industries/RPS Automation is a manufacturer of automated selective soldering, component lead tinning, and solderability test equipment for electronics and electronic component manufacturing, assembly, and distribution. Hentec/RPS has been advancing automated soldering and lead finishing technology for defense, aerospace, automotive, contract manufacturers and micro-electronics component manufacturers since the early 90’s. All Hentec/RPS products are designed and manufactured in Newman Lake, Washington. For more information, please visit us at www.rpsautomation.com.

J.A.M.E.S will be presenting its innovative Additively Manufactured Electronics (AME) cloud-based platform to visitors of electronica 2022. This is the first comprehensive online community of 3D printed electronics dedicated exclusively to the AME sector.

J.A.M.E.S stands for “Jetted Additively Manufactured Electronics Sources,” and was founded to advance the development of AME (Additively Manufactured Electronics) through a collaborative space that delivers technical know-how, design enablement and real-time communication, within a diverse global community, and at all levels of expertise.

J.A.M.E.S cloud-based platform exclusively dedicated for AME, is an authoritative source where enthusiasts and professionals from the industry and academia, will be challenged to learn, improve, and grow together, as we harness the power of AME to disrupt and redefine the electronics industry. Additive Manufacturing (AM) defines any manufacturing process that applies material layer by layer, or additively, to create three-dimensional objects. The addition of an electronic functionality is the next revolutionary step that transforms AM to AME. AME is leveraging advanced manufacturing while being much more environmentally friendly. Material is only added where it is needed and the waste from the production process is reduced enormously. In addition, as 3D printers can print in microns, the size of the electronics can be significantly reduced while maintaining or exceeding current performance.

Visitors to electronica will have the opportunity to meet the J.A.M.E.S team, learn more about the community of 3D printed electronics, sign up, and get-together with other community members who are open to share their expertise and experience. Also on booth B1.507, you’ll be able to see and touch real AME products designed and manufactured by J.A.M.E.S at their own custom-built laboratories. The exhibition will include the live population of the J.A.M.E.S coin, an AME NFC (Near-Field Communications) device that can be used as a digital business card, on an Essemtec assembly line. CEO Andreas Müller and CTO Andreas Salomon will be on hand to talk about the community and the efforts to make AME accessible and usable by the whole industry.

The vision of J.A.M.E.S is to lead a revolution in electronic design and manufacturing, which already counts on the support of key industry players, XTPL and Fraunhofer IKTS as partners. J.A.M.E.S invites you to join the growing community and learn more at https://j-ames.com/