Press Releases
EDEN PRAIRIE, MN – September 2022 – The Women’s Leadership Program (WLP), an SMTA-sponsored organization that strives to promote diversity and inclusion in engineering and manufacturing fields, announces that it will host invited presentations about technology innovations and career advancements on Tuesday, November 1, 2022. The free event will take place from 1-6 p.m. with an agenda designed to promote women in engineering fields. Everyone is welcome to attend.
The first event, co-chaired by Tanya Martin of the SMTA and Jessica Molloy of ZESTRON, will take place from 1-3:15 p.m. Three invited presentations focusing on technology innovations and career advancement will provide a valuable resource to attendees. Carolyn Duran, Ph.D. of Intel Corporation, will discuss the importance of lifelong learning, Loretta Renard of REMAP will focus on changing the perception of manufacturing, and Jayshree Seth, Ph.D. of 3M, will share information about leaders and ladders.
There will be a brief 15-minute refreshment break following the presentations.
Co-chaired by Debbie Carboni of KYZEN and Julie Silk of Keysight Technologies, the second event will take place from 3:30-4:30 p.m. During this quick-moving, interesting event, attendees will rotate through six tables hosted by the invited speakers as well as SMTA leaders on topics related to leadership skills, continuous learning, career development, innovation and more.
The day will end with a social that is co-chaired by Michelle Ogihara of Seika Machinery Inc. and Sherry Stepp of KYZEN from 4:30-6 p.m.
To find out more about the Women’s Leadership Program, visit www.smta.org/page/wlp.
PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center. pcbwest.com
As an industry leader in innovative materials solutions for heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications, Indium Corporation® will feature innovative material solutions designed to meet the evolving challenges of SiP and HIA at the 55th International Symposium on Microelectronics (IMAPS) from Oct. 3-6 in Boston, Mass., U.S.
Indium Corporation’s proven SiPaste® series is specifically designed for fine-feature printing with fine powders ranging from Type 5 to Type 8. They help Avoid the Void®, reduce slumping, and demonstrate consistent superior printing performance. Water-soluble SiPaste® 3.2HF has been adopted by leading OSATs and has been used in more than 5 billion mobile FEM SiP modules. The newly released SiPaste® C201HF offers the same superior printing performance with the benefit of having a cleanable chemistry with semi-aqueous-based solutions.
As the industry leader in no-clean semiconductor flux, Indium Corporation will also feature the first low-residue no-clean, ball-attach flux on the market, NC-809. NC-809 is a dual-purpose flux, engineered with high-tack characteristics for flip-chip applications and with adequate wetting power for ball-attach applications. This material is designed to hold die or solder spheres in place without risk of die shift or solder sphere movement during the assembly process. NC-809 is designed to leave minimal residue after reflow, at the level of Indium Corporation’s proven ultra-low residue (ULR) flip-chip fluxes such as NC-26S and NC-699. NC-809 exhibits superior wetting performance and is the first ULR flux qualified for ball grid array ball-attach applications for packages that are sensitive to traditional water cleaning processes. NC-809 also improves production yields by eliminating costly cleaning steps which can increase substrate warpage both after reflow and before the underfilling steps, creating the potential for die damage and cracked solder joints.
NC-809 offers:
• High tackiness to eliminate die tilting or shifting during reflow; greatly reducing electrical open failures
• Consistent flux deposition and excellent wetting
• Ultra-low residue; ideal for customers building tight-pitch flip-chip assemblies
• Compatibility with a wide variety of underfills
• Reduced warpage of package and lower thermal stress due to absence of cleaning step
About Indium Corporation
Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
About IMAPS
The International Microelectronics Assembly and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through premier professional events, an exclusive microelectronics packaging research library, local chapter networks, and other efforts. Founded in 1967 as ISHM, then merging with the International Electronic and Packaging Society (IEPS) in 1996, the Society has over 50 years of networking, education, and publication history.
PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center. pcbwest.com
Austin, TX – September 2022 – Austin American Technology (AAT) is pleased to announce that it has further expanded its brand by adding Restronics as its new representative/distributor in Southern California. Andy Black, Managing Partner, and Brad Lemmen, Manufacturers’ Representative, will represent AAT’s industrial grade batch cleaners, in-line cleaners, solvent cleaners, stencil cleaners and more.
Justin Cody Worden, Director of Business Development, commented: “I have spent the majority of my adult life living in San Diego and know how important it is to have top quality support and representation in this part of the country. Restronics provides the experience and resources needed to make sure every customer is properly supported with the AAT brand.”
Restronics’ national structure and centralized marketing resources enable its salespeople to spend more time with end-user customers and less time with non-selling activities. Mr. Black covers San Diego County, Orange County, Inland Empire and Southern Nevada. Mr. Lemmen’s territory includes: Los Angeles, Ventura, Santa Barbara, San Luis Obispo and Kern Counties.
Restronics’ Southern California team represents some of the leading product lines in the electronic manufacturing equipment and supplies industry. The company takes a consultative approach to determine and represent the perfect solution for its customers’ PCB and medical device manufacturing needs.
AAT cleaners are design-driven by the science of cleaning. They are used for the following applications: Printed Circuit Board (PCB) Cleaning, Surface-Mount Technology (SMT), Stencil & Misprint, Flip Chip, and BGA, in several industries including: automotive, medical, military, and aerospace. All cleaners are manufactured and built to each customers’ specific needs in Austin Texas.
For more information about Restronics SoCal, contact Andy Black at (858) 449-3128 or email ablack@restronics.com.
For more information about Austin American Technology, please visit www.aat-corp.com.
PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center. pcbwest.com
2022-09-15 – Seoul, Korea – Koh Young, the industry leader in True 3D measurement-based inspection solutions, is eager to explain how optical inspection drives Electronic Vehicle (EV) reliability upwards. We will present sessions on 22 September 2022 in Chinese and on 29 September 2022 in Japanese. Our panel of technology and application experts will be available following the presentation to field questions about EV inspection solutions during a live panel session.
During the presentation, we will explore relevant EV technologies and trends by incorporating specific real-world application challenges and solutions. Attendees will be presented exclusive information about how several different Koh Young solutions will improve manufacturing yield and quality across several stages of the production process.
Register now for the online seminar “Optical Inspection Drives EV Reliability” by clicking the “Register Now” link or visit our website www.kohyoung.com. During registration, you may submit specific questions for our panel of experts to address during the live Q&A session.
Date Time Language Registration
Thursday, September 22, 2022 3:00PM Beijing Time (BJT) Chinese https://meeting.tencent.com/dw/PZaocp1FM7X8?ch=kQoV1nr3JNr2x
Thursday, September 29, 2022 11:00AM Japan Standard Time (JST) Japanese https://us06web.zoom.us/webinar/register/1716624464292/WN_g2d_j4MISDW4ylvvd0iCMg
If you cannot attend Koh Young Future Forum 2022, you can still learn more about Koh Young and its award-winning solutions by visiting our website at www.kohyoung.com.
About Koh Young Technology, Inc.
Established in 2002, Koh Young pioneered the market by launching the first 3D Solder Paste Inspection (SPI) system using a patented dual-projection Moiré technology. Since then, it has become the global leader in 3D measurement-based SPI and Automated Optical Inspection (AOI) equipment for the electronics industry. Based on its True3D™ measurement-based inspection technology, Koh Young has developed innovative solutions for challenges with Machining Optical Inspection (MOI), Dispensing Process Inspection (DPI), and Semiconductor Packaging Inspection (MEISTER Series). Through its technology innovations, Koh Young has secured thousands of global customers, and maintains the largest global market share in the SPI and AOI markets. Additionally, by adopting its user-centric R&D activities, it continues to use its core competencies and develop innovative solutions for new and existing markets. Its activities stem from the corporate headquarters in Korea to its global sales and support offices in Europe, Asia, and the Americas. These local facilities ensure it keeps in close contact with the market, and more importantly, its growing customer base to provide access to an award-winning network of inspection and measurement experts. Learn why so many electronics manufacturers trust Koh Young for reliable inspection at kohyoung.com.
For More Information
Koh Young Technology, 14F Halla Sigma Valley, 53 Gasandigital 2-ro, Geumcheon-gu, Seoul, Korea 08588 marketing@kohyoung.com www.kohyoung.com
(Waterbury, CT USA) – September 15th, 2022 – MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions, will present two papers on its latest low temperature solutions at upcoming SMTA Expos, the first at SMTA Guadalajara which will be held at the Expo Guadalajara from September 21 – 22, and the second at the SMTA Empire in New York on September 27.
Francisco Gallegos, Customer Technical Support Engineer at MacDermid Alpha will present the paper, ‘Low Temperature Soldering: Traditional Sn-Bi based alloys and latest developments in high reliability alloys for SMT and PTH applications’ at 10.30am CT on Wednesday 21st September at the SMTA Guadalajara Expo. The paper will discuss MacDermid Alpha’s latest low temperature innovation, ALPHA OM-565 HRL3 solder paste. Designed to mitigate warpage induced defects in temperature sensitive chip-scale packages, the solder paste enables peak reflow of 175°C to minimize post reflow defects such as Non-Wet-Open (NWO) and Head-in-Pillow (HiP).
Lily Zeiler, District Sales Manager for Northeast US at MacDermid Alpha will present, ‘Low Temperature Soldering: Why LTS is Now a Potential and Viable Option for Many Applications’ at 1:00pm EST on Tuesday 27th September at the SMTA Empire Expo. The paper will discuss how by enabling lower peak reflow temperatures, low temperature solders offer manufacturers considerable process, reliability, and sustainability benefits for a broad range of applications.
In addition to its low temperature technologies, including ALPHA OM-565 HRL3, MacDermid Alpha will also promote its range of ALPHA HiTech adhesives, underfills, edgebonds and encapsulants at both expos. The ALPHA HiTech range of polymer materials are designed to provide enhanced protection for assembled chip components for a broad range of applications including automotive, camera module and mobile. Also featured will be MacDermid Alpha’s Reclaim and Recycling Program, which provides a safe and efficient service enabling customers to meet their environmental and legislative requirements, and at the same time maximize the return on their waste streams.
Visit MacDermid Alpha at booth #300 at the SMTA Guadalajara Expo and the MacDermid Alpha table at SMTA Empire for more information on our high reliability and low temperature solutions. To register for these SMTA Expos please visit: Events - SMTA
To learn more about MacDermid Alpha’s circuit board assembly solutions please visit: macdermidalpha.com
About MacDermid Alpha Electronics Solutions:
Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, Electrolube, Kester, and MacDermid Enthone brands, MacDermid Alpha Electronics Solutions provides solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Assembly Solutions, Semiconductor Solutions, and Circuitry Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time.
As part of its electric vehicle (EV) focused series of webinars, Driving e-Mobility: Rel-ion™ Technical Webinars, Indium Corporation’s Jonas Sjoberg, associate director for global technical service & application engineering, and Ângelo Marques, applications engineer – design for excellence (DfX) specialist, will share considerations for the implementation of high-density assembly in the automotive space.
In Design Considerations for Board Layout and Material Selection, Sjoberg and Marques will discuss how implementing high-density SMTA assemblies in electronic products require many considerations. Previously, high-density SMTA assemblies were primarily used in mobile phones and consumer electronics. However, the rapid growth of EVs and more sophisticated electronics on all types of automobiles shows that these high-density assemblies are not being fully adapted into the automotive market. Before starting any developmental work or implementing a new technology, it is critical to understand the products, their capabilities, and industry requirements. If these are not fully understood, failure is the most probable outcome.
This presentation will discuss conducting DfX based on end-product requirements and the need to perform proper root cause analyses before making any material or process changes.
This session of Driving e-Mobility: Rel-ion™ Technical Webinar series is scheduled for Sept. 21 with two opportunities to participate: the first at 8:30 a.m. Germany/12 p.m. India/2:30 p.m. China and Malaysia, and the second at 10 a.m. San Francisco/1 p.m. New York/6 p.m. London/7 p.m. Germany.
The Driving e-Mobility: Rel-ion™ Technical Webinars series features global industry technical experts in advanced materials and the automotive market, with all sessions moderated by Brian O’Leary, Indium Corporation’s global head of e-Mobility and infrastructure. This series of webinars is intended specifically for those involved in the field of e-Mobility, whether new to the industry or with several years of experience, as the EV industry undergoes rapid growth and evolution.
Registration for this webinar—as well as the rest in this series—is open and can be completed at indium.com/corporate/media-center/webinars/rel-ion.php. If you are interested in a session specifically tailored to your company’s needs, please contact O’Leary at boleary@indium.com.
Sjoberg is Associate Director for Global Technical Service & Application Engineering for Indium Corporation. He is based in Kuala Lumpur, Malaysia, where he provides technical support to key regional and global customers. He has more than 25 years of technical experience in the electronics industry, including developing and deploying leading-edge designs and processes for packaging and assembly; managing research and development projects and facilities; and serving as technical advisor to internal and external design, development, and manufacturing sites worldwide. He has presented and published numerous papers at industry leading electronic conferences/magazines and is an appointed distinguished speaker at SMTAI.
Marques’ expertise in automotive electronics, especially in DfX for stencils, PCBs, and complex components, continues to help Indium Corporation’s customers shorten DV / PV (design validation / production validation) lifecycles and launch earlier into SOP (Start of Production) with optimized manufacturing processes with reduced defects and increased yields. In addition to his new role as DfX Specialist, Marques continues to provide technical support, share process knowledge, and make recommendations for the use of Indium Corporation’s materials in PCBA throughout Europe’s Latin region as an applications engineer. An Indium Corporation employee since 2017, Marques possesses over 25 years of automotive electronics experience in new product introduction and process optimization. He has a Six Sigma Green Belt and is an IPC 610 certified trainer. He is trilingual and can speak and write Portuguese, English, and Spanish.
O’Leary is responsible for promoting Indium Corporation’s full range of products and services for e-Mobility, which includes electric cars, trucks, and charging stations. He has more than 20 years of experience in sales, marketing, and channel management in the electronics industry. He currently serves as the chair of the IPC EV (Electric Vehicle) Quality & Reliability Advisory Group. In addition to regular technical conference participation, Brian co-hosts a free monthly webcast—EV InSIDER Live—with Loren McDonald of EVAdoption and a high-profile industry stakeholder as a guest. In the webcast, they discuss current pressing issues and hot topics in the rapidly evolving electric vehicle landscape.
The next session in the Driving e-Mobility: Rel-ion™ Technical Webinar series on Oct. 12 is Best Practices for SMT Assembly & Root Cause Analysis, presented by Principal Engineer, Global Accounts Technical Manager David Sbiroli.
About Indium Corporation
Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.
For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/ or @IndiumCorp
PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center. pcbwest.com
