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Press Releases

ATLANTA — ECIA is pleased to announce the 2024 Executive Conference Core Committee. Previously announced Chair Ken Bellero, Schaffner, and Co-Chair Maryellen Stack, Sager Electronics have finalized the core committee of returning and new members who already have hit the ground running for the best conference yet.

  • Pam Berigan, Sager Electronics
  • Lori Bruno, LuscomBridge
  • Tobi Cornell, Kruvand Associates
  • Robert Derringer, Crouzet
  • Juliet Fajardo, TDK-Lambda
  • Heather Fulara, DigiKey
  • Bob Garcia, Ferrari Technical Sales
  • Nicolle Ladouceur, ROHM Semiconductor

“I am really looking forward to working with this talented group of people,” commented Stephanie Tierney, ECIA’s Director of Member Communications and Member Engagement. “2023 was a record-breaking conference on many levels: sponsorships, attendance, survey responses and more were all ahead of the year before. This group has already vowed to surpass those records, and it will be fun working with them to meet the ambitious goals they have set for the 2024 Conference,” she continued. “All I can say is, ‘Watch out for another great event planned by this fantastic committee!’”

Subcommittees will be announced soon. For more information, go to https://www.eciaexecconference.org/. Sponsorship opportunities have been released and are filling up fast!

BANGKOK, THAILAND – Fabrinet (NYSE: FN), a leading provider of advanced optical packaging and precision optical, electro-mechanical and electronic manufacturing services to original equipment manufacturers of complex products, today published its Sustainability Report for fiscal year 2023. The report highlights Fabrinet’s continued commitment to operating in an ethical, environmentally responsible, and socially supportive manner.

Seamus Grady, Chief Executive Officer of Fabrinet, said “Fabrinet’s commitment to community, sustainability and accountability is integral to our ability to drive value for our customers, employees and shareholders. Over the past year, we advanced our sustainability initiatives across multiple fronts, and are proud to share our progress with our stakeholders and the broader community.”

The report covers Fabrinet’s progress toward sustainability initiatives in fiscal year 2023, including:

  • Improving quality of life for our local communities
  • Expanding our talent pipeline through internship opportunities
  • Upholding our dedication to labor and human rights
  • Identifying sustainability opportunities through lean manufacturing
  • Reducing our carbon footprint
  • Advancing our approach to ESG oversight

The full report can be accessed on Fabrinet’s website at www.fabrinet.com/about/esg-initiatives

WASHINGTON – The Semiconductor Industry Association (SIA) today released the following statement from vice president of government affairs David Isaacs in response to the introduction in Congress of the Tax Relief for American Families and Workers Act. The legislation includes two provisions critical to the semiconductor industry: the restoration of domestic R&D expensing and the United States-Taiwan Expedited Double-Tax Relief Act.

“SIA applauds Senate Finance Committee Chair Ron Wyden (D-Ore.) and House Ways and Means Chair Jason Smith (R-Mo.) for spearheading the Tax Relief for American Families and Workers Act. The legislation restores domestic R&D expensing and seeks to resolve tax matters between the U.S. and Taiwan—two provisions essential to ensuring the competitiveness of the U.S. semiconductor industry and fully realizing the benefits of the CHIPS and Science Act.

“The CHIPS Act was passed, in part, to help unlock investments in the semiconductor R&D ecosystem here in the U.S. The requirement of amortizating research expenditures undermines those efforts and runs counter to the longstanding immediate deduction of R&D costs that helps to sustain U.S. leadership in this vital technology.

“We must resolve double taxation between the United States and Taiwan and reduce barriers to trade between the two jurisdictions. At a time the semiconductor industry is making significant investments in the U.S. following the passage of the CHIPS Act, reconciling tax matters between the U.S. and one of its top trading partners has become a pressing matter.

“We further commend the House Ways and Means Committee for approving the tax package that would implement tax policies central to the success of the U.S. semiconductor industry. We urge the House and the Senate to take up and pass this critical legislation.”

SAN DIEGO – KIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, announces that Miles Moreau, General Manager, will be a featured speaker at the SMTA Wisconsin Chapter In-Person PCBA Profile Workshop. The workshop is scheduled to take place on Wednesday, Feb. 21, 2024, from 8:30 a.m. to 3 p.m. CST at Delta Hotel Menomonee Falls.

The workshop will feature speakers from profile equipment suppliers, SMT Oven (reflow), Selective Solder, Wave Solder equipment suppliers, and Solder suppliers. Workshop topics will cover Best Practices, Tips and Tricks, How to Profile, Machine Health, and Solder Defects.

Miles Moreau, with decades of experience in the electronics and semiconductor manufacturing industry, will delve into profiling basics and best practices contributing to the knowledge exchange at the Wisconsin Chapter workshop.

As General Manager at KIC, Moreau has been instrumental in defining the company's product roadmap and bringing innovative solutions to the market. He holds numerous US and international patents through his work at KIC.

For more information about KIC and its revolutionary solutions, please visit www.kicthermal.com

ATLANTA, GEORGIA – Koh Young Technology, the leader in True3D™ measurement-based inspection solutions, will be speaking at the SMTA Wafer-Level Packaging Symposium in Burlingame, California on our Multimodal Phase Shift Optics Approach to revolutionize high-speed 3D reconstruction of semiconductor and advanced packages. In the presentation will highlight how high-speed 3D reconstruction addresses the growing demand for electronic components, which necessitates fast and efficient processing. These advancements in measurement technology and AI integration have paved the way for enhanced packaging applications in the semiconductor industry.

During the event on Tuesday, 13 February 2024, Dr. Seung Hyun Lee, Ph.D. will present the paper “High-Speed Die and Component 3D Reconstruction Solution by Multimodal Phase Shift Optics Approach”. Therein he will explain how advancements in optical 3D measurement and the integration of Artificial Intelligence (AI) have paved the way for advanced packaging applications. Multi-modal measurement probes, equipped with enhanced depth of focus, can cover height differences in the latest package designs. Various surface conditions of components, chips, and surfaces are measured by combining an oblique optical system, which ensures stable high-speed measurement of objects with diffuse reflection, with a coaxial optical system, suitable for measuring objects with specular reflection. The integration of AI deep learning technology enables effective processing of various noises encountered during the measurements.

The SMTA WLPS will explore the massive changes in advanced package technology because electrical system architects are directly driving package performance requirements, something which has never happened before. Previously System Architects designed circuits around package limitations because pushing package technologies outside of their “comfort zones” often led to undesirable results. With the rise in transistor costs and the need to improve power efficiency, Silicon Architects have little choice but to push advanced package technologies well beyond their comfort zones.

The Wafer-Level Packaging Symposium will bring together the semiconductor industry’s most respected authorities to address all aspects of wafer-level, 3D device packaging, advanced manufacturing & test technologies. Addressing wafer-level packaging, 3D, and Advanced Manufacturing & Test technologies, the Wafer-Level Packaging Symposium will be at the forefront of packaging technology evolution. The conference will feature attendees from around the globe in the heart of Silicon Valley to immerse themselves in the latest technology and business trends. Register today at www.smta.org/mpage/wafer-register 

BOSTON, MA – Creation Technologies, an end-to-end, scalable Specialty Global Electronic Manufacturing Services provider, proudly announces the successful ribbon-cutting ceremony held on January 22, 2024, at its newly expanded facility in Markham, Ontario. The event, attended by guests including Frank Scarpitti, Mayor of Markham, and Stephen P. DeFalco, Chairman and CEO of Creation Technologies, marked a significant milestone for the company.

The recently held ribbon-cutting event celebrated the move to a new site in Markham, which now boasts a custom- built, state-of-the-art space spanning 118,500 square feet. The new location represents a 54% larger physical footprint for Creation Technologies in Markham.

With over 300 employees currently working at the new Markham facility, Creation Technologies can offer customers even greater capacity and capabilities. The ribbon-cutting event celebrated not only the move to a new, significantly larger facility but also the company's ongoing commitment to the Markham community and its contributions to the local economy. The Markham site joins a list of recent site expansions in Changzhou, China, St. Paul, MN, and Rochester, NY.

Stephen P. DeFalco, Chairman and CEO of Creation Technologies, expressed his gratitude, stating, "We are excited about the opportunities that our expanded Markham facility brings. Our dedicated team and the support of the local community have been instrumental in reaching this milestone. We look forward to continuing our legacy of providing exceptional electronics design and manufacturing solutions for our customers."

Creation Technologies is a global electronics design and manufacturing services provider, delivering total product lifecycle solutions to OEM customers in the Aerospace & Defense, Medical Device and Tech Industrial markets. With a commitment to excellence, innovation, and community engagement, Creation Technologies continues to be a trusted partner for OEMs worldwide.

For more information, visit www.creationtech.com 

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