MANASSAS, VA – ZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, proudly announces that Senior Application Engineer Ravi Parthasarathy will be presenting a technical session titled "Optimizing High Bandwidth Memory (HBM) Wafer Surface Treatment: Navigating Cleaning Challenges" at the upcoming Surface Mount Technology Association (SMTA) Wafer Level Packaging Symposium.

Scheduled for February 13th, 11:30 AM to 12:00 PM, Ravi Parthasarathy's presentation will delve into the intricacies of enhancing High Bandwidth Memory (HBM) wafer surface treatment processes while addressing the unique cleaning challenges associated with this advanced technology.

As a seasoned professional in the electronics manufacturing industry, Ravi brings a wealth of knowledge and hands-on experience to this presentation. His insights into optimizing HBM wafer surface treatment will prove invaluable for engineers, researchers, and professionals seeking to stay at the forefront of wafer-level packaging advancements.

For more information about the SMTA Wafer Level Packaging Symposium and to attend Ravi Parthasarathy's presentation, please visit https://smta.org/BlankCustom.asp?page=wafer 

CYPRESS, CALIFORNIA – Hanwha Techwin Automation Americas, Inc., a pioneer in precision manufacturing and technology, announces the appointment of Gustavo Jimenez as the new General Manager for Mexico. This strategic appointment comes at a time when Hanwha Techwin is solidifying its presence in the region and reinforcing its commitment to driving innovation and excellence in the electronic manufacturing industry.

Gustavo Jimenez, an accomplished Sales and Engineering professional, brings to the table a rich blend of expertise and a proven track record in the electronic manufacturing industry, particularly in Surface Mount Technology (SMT). With a strong foundation in Industrial and Systems Engineering from Universidad del Valle de México, Gustavo has honed his skills in Sales, Negotiation, Accounts Management, Project Management, and Customer Service. His vast experience and profound knowledge of the industry make him the ideal leader to steer Hanwha Techwin’s operations in Mexico towards unprecedented growth and success.

Hanwha Techwin is renowned for pushing the boundaries of technology, as recently demonstrated at the exclusive VIP events held in Guadalajara at its Center of Excellence (CoE) in Cypress, CA. The events showcased groundbreaking advancements, including the unveiling of the HM520W, part of Hanwha Techwin’s high-performance pick-and-place series, and the introduction of the innovative XM520 Blended Mounter.

The company’s commitment to innovation and customer-centric solutions is evident in the recent enhancements across its range of technologies, ensuring increased efficiency, productivity, and profitability. The introduction of the HM520W and the XM520, along with the revolutionary D2 different product dual line capability, underscores Hanwha Techwin’s position as a leader in odd- form component handling and a pioneer in the industry.

Gustavo Jimenez, commenting on his new role, stated, “I am excited to join Hanwha Techwin, a company that stands at the forefront of technology and innovation. I look forward to leveraging my experience and expertise to further strengthen our position in Mexico, enhancing our customer relations, and contributing to the company’s global competitiveness initiatives.”

Tim Kang, CEO of Hanwha Techwin Automation Americas, Inc., expressed his enthusiasm about the new appointment, “We are delighted to welcome Gustavo Jimenez to our team. His extensive experience and profound understanding of the industry align perfectly with our vision and goals. With Gustavo at the helm in Mexico, we are confident that Hanwha Techwin will continue to drive innovation, exceed customer expectations, and set new benchmarks in the industry.”

Under the leadership of Gustavo Jimenez, Hanwha Techwin is set to embark on a new chapter of growth and innovation in Mexico, reinforcing its commitment to delivering state-of-the-art solutions and supporting manufacturers in their pursuit of excellence and global competitiveness. For more information about Hanwha Techwin, please visit www.hanwha-pm.com 

CRANFORD, NJ ― PIT – Equipment Services, LLC, a leader in the electronics sector, is thrilled to announce that Don Dennison, President of the company, has been appointed as the VP of Technology and Chapter Advisor for the SMTA Long Island Chapter. This prestigious appointment comes as a testament to Mr. Dennison’s dedication, expertise, and significant contributions to the electronics industry.

Don Dennison, a visionary with profound experience in the electronics sector, has spearheaded PIT Equipment Services to remarkable achievements over the past four decades. His leadership has not only guided the company to success but has also earned them consecutive Global Technology Awards for Rep of the Year for North America. The company, under his stewardship, has become synonymous with excellence and innovation, serving electronic assembly firms with unmatched support and expertise.

The Surface Mount Technology Association (SMTA) recognizes individuals who demonstrate exceptional merit and knowledge in the field, and Mr. Dennison’s appointment reflects his unwavering commitment and profound impact on the industry. His new role as VP of Technology and Chapter Advisor will involve guiding the Long Island Chapter, sharing his vast knowledge, and furthering the mission of SMTA to build skills, share practical experience, and develop solutions in electronic assembly technologies and related business operations.

Tom Zanatta, the Long Island Chapter President, expressed his enthusiasm about the new appointment, saying, “Don Dennison’s appointment brings an incredible wealth of knowledge and industry insight to our chapter. His exemplary leadership in the field is what sets him apart, and we are excited to see the direction in which he will steer our activities and initiatives. Congratulations, Don, on this well-deserved role!”

This appointment is not just a milestone for Don Dennison but also a significant development for the SMTA Long Island Chapter, promising a future of enriched expertise, enhanced technological advancement, and strengthened industry connections.

For more information about PIT Equipment Services and their offerings, visit www.pit-equipmentservices.com  

MINNEAPOLIS, MN – The SMTA is pleased to announce the Best Papers from SMTA International 2023. The winners were selected by members of the conference technical committee. This year awards were given for the "Best of Proceedings" category but also for a new designation of "Best Practical and Applications-Based Knowledge." A plaque is given to primary authors of all winning papers for these exceptional achievements.

The following paper was selected for the “Best of Proceedings” award:

"A Collaborative Consortia Project to Assess the Effect of Thermal Cycling Dwell Time on the Reliability of High-Performance Solder Alloys." Richard Coyle, Ph.D., Nokia Bell Labs, and Joint Chair of the iNEMI and HDP 3rd Generation Solder Alloy Project accepts the award on behalf of the Collaborative iNEMI and HDP Consortia Teams.

The following three papers received honorable mention in this category:

"Study of the FCBGA Package Interfaces Reliability Under Monotonic and Fatigue Loads after Sustained High Temperature" by Pradeep Lall, Ph.D., Aathi Pandurangan, Padmanava Choudhury, and Madhu Kasturi, Auburn University.

"A Path to Ductile Low Temperature Solders for Mass production of Electronic Assemblies" by Keith Sweatman, P.E., Nihon Superior; Xin Fu Tan, Qichao Hao, Stuart D. McDonald, Michael Bermingham, Kazuhiro Nogita, The University of Queensland; Qinfen Gu, ANSTO; and Tetsuro Nishimura, Nihon Superior.

"Comparison of Electromigration in Tin-Bismuth Planar and Bottom Terminated Component Solder Joints." Prabjit Singh, Ph.D., IBM Corporation, and Technical Leader of the iNEMI Electromigration Project accepts the award on behalf of the iNEMI project team.

The following paper was selected for the “Best Practical and Applications-Based Knowledge” award:

"Managing Thermomechanical Behaviour in Automotive Electronics" by Maurice Dore, Valeo.

The following two papers received honorable mention in this category:

"Intermetallic Compounds in Solder Alloys: Common Misconceptions" by David Hillman, Hillman Electronic Assembly Solutions; Tim Pearson, Collins Aerospace; and Richard Coyle, Ph.D., Nokia Bell Labs.

"Performance Comparison of Contemporary Stencil Coatings and Under Wipe Solvents on 0.4mm BGA Packages" by Chrys Shea, Shea Engineering Services; Debbie Carboni, KYZEN Corporation; and John Hanerhoff, Garmin International.

The authors will receive their awards during a ceremony at SMTA International 2024. The SMTA International Conference and Exhibition (SMTAI) 2024 will be held October 21 - 24, 2024 at the Donald E. Stephens Convention Center in Rosemont, IL, USA. Details on participating in the 2024 SMTA International Conference are posted on the event website:

https://www.smtai.org/call-for-abstracts 

Abstracts of all papers can be browsed directly in the online Knowledge Base. Featuring thousands of full-length technical articles, the SMTA Knowledge Base is searchable to all visitors, but free PDF downloads are available only to SMTA members. Non-members can easily join SMTA for real-time access to the Knowledge Base.