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ICCON Block and ICCON Insert connectors address high current rating demands from high-speed board-to-board and board-to-busbar data communication applications.

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Palomar 8100 automated, thermosonic high-speed ball-and-stitch wire bonder performs ball bumping and customized looping profiles.

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VEMD4010X01 and VEMD4110X01 surface-mount automotive-grade silicon PIN photodiodes come in 0805 case size with 0.7mm profile.

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