Products
Grypper test sockets are for BGA devices, including large array ASICs; I/O down to 0.35mm pitch.
Fulabox dry box controls condensation that attacks moisture-Sensitive devices and filament.
Master Bond EP21AC is a two-part epoxy with non-halogenated filler formulated for applications where arc resistance and flame retardancy are required.
Press Releases
- Surf-Tech Manufacturing Adds New ViTrox V510i AOI to Strengthen Advanced Packaging Inspection
- Altus Supports Cambertronics’ SMT Process Upgrade with Koh Young SPI
- Ben Maulorico joins Insight Polymers & Compounding as business development manager
- Strengthening SEMI Business (Semiconductor Back-End Process) in the European Market