Products
Solder Coat Co. Ltd. (Nagoya, Japan) is introducing the GTS series of lead-free solder paste in North America and Europe.
The paste can withstand a preheat temperature of up to 200°C for 2 minutes. Does not require refrigeration for storage and transport, thus reducing handling care and cost.
www.all4-pcb.us/lfreesolder1.htm (North America)
Pyramax 98 solder reflow oven is now equipped with an integrated flux coating and wafer handling system for wafer bump reflow. The coating system can handle 200 or 300 mm wafers and is configured with an integrated robotic wafer handler.
At the oven's back-end, an automated unloading station completes the integrated wafer handling process.
Features forced impingement technology for temperature uniformity and an optional closed-loop convection control for constant heat transfer and cooling rates. Provides atmosphere purity below 5ppm and reportedly has the industry's lowest nitrogen consumption.
The user-friendly SlimKIC 2000 profiler and process development tool has been upgraded to accommodate new applications including rework, batch ovens, and high- temperature furnaces. The new applications are built directly into the standard software at no additional cost.
With the conversion to lead-free manufacturing and its narrow thermal process window, rework is more critical and requires better profiling tools. The new software, which claims to provide better control and documentation of the rework process, is on display at booth 5015 at the Assembly Technology Expo this week in Rosemont, IL.
Press Releases
- Naprotek Appoints James Eisenhaure as Chief Financial Officer
- Naprotek Appoints James Eisenhaure as Chief Financial Officer
- ViTrox Announces Strategic Partnership with Maxim SMT to Strengthen Presence in India
- Incap UK achieves JOSCAR Zero accreditation – Strengthens its position in the defence and aerospace sector