VT-S10 series 3D AOI uses multi-direction, multi-color imaging, MPS 3D hardware and AI to reduce false calls, improve first-pass yields and optimize defect detection.
Meister D+ True3D inspection system is for chiplets and system-in-package devices, including die and surface mount components.
Includes enhanced support for flex/rigid-flex and embedded component visualization in 2-D and 3-D environments.