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Products

VT-S10 series 3D AOI uses multi-direction, multi-color imaging, MPS 3D hardware and AI to reduce false calls, improve first-pass yields and optimize defect detection.

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Meister D+ True3D inspection system is for chiplets and system-in-package devices, including die and surface mount components.

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Includes enhanced support for flex/rigid-flex and embedded component visualization in 2-D and 3-D environments.

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