Products
Xpert3 kit works with the SuperM.O.L.E. Gold thermal profiler to automate convection reflow oven process development. Distills recipe development into three steps: Create Signature; Plan Target; and Set & Verify.
Signature Wizard helps create an oven signature file for your reflow oven at a given convection rate. With that oven selection in place you plan robust target profiles, choosing from the 400 solder paste formulations in the database. Entering Assembly Properties information completes the planning stage and Set & Verify delivers the oven recipe.
A solder paste specification may be set to your choice of Ramp-Soak-Spike or a Ramp-to-Spike profile. Converting an existing process to a Pb-free paste is quick and easy. Qualify your oven's Pb-free capability by observing if the required zone setpoints per conveyor speed exceed the oven's maximum capability. The Transpose command immediately converts a profile to your new oven, and the system works with any reflow oven.
ECD, www.ecd.com
ProFlow enclosed print head is a key element of the lead-free portfolio DEK has created to help the transition to high-quality, repeatable lead-free processing. When implementing lead-free assembly, high accuracy mass imaging using the print head reportedly maximises the process window, compared to conventional squeegee blades.
Reduces the number of variables – such as paste rheology and ambient humidity – that need to be controlled for lead-free utilisation. The result is a simplified paste evaluation process and confident vendor selection, supported by repeatable results to justify procurement decisions.
In operational use, the greater transfer force maximises stencil aperture fill and paste release efficiency. Has repeatable aperture filling, low paste wastage and high throughput.
According to Christopher Associates, OEM requirements for improved manufacturing yields have led to strong demand for the Koh Young 3 dimensional solder paste inspection systems.
The KY 3030VAXL (24 x 27” panel size) high-speed 3-D solder paste inspection system was developed to inspect very high density, high technology telecommunications substrates for 100% volumetric and shape defects. Designed, manufactured and delivered within 10 weeks of receipt of order to a large EMS manufacturer.
Additional installations include a number of the KY 3030VAL (18 x 20” substrate) systems installed at a major EMS manufacturer; a major automotive electronics manufacturer has also ordered multiple systems. Among the advantages cited after extensive evaluations by each customer were ease of use, accuracy and speed.
Christopher Associates Inc., christopherweb.com
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