Products
Wedge emulation technology is for low profile interconnects, fine pitch, running stitch interconnects, and die-to-die bonding in high-density packages such as LEDs and RF packages. Uses Model 8000 ball bonder. Said to bond seven to 12 wires per second. Can program an interconnect beginning with a stitch instead of ball; complies with visual standards defined per Mil-Std-883, Method 2017. Can use a wire other than gold, such as aluminum or copper.
Palomar Technologies, www.palomartechnologies.com
IPC-7351A LP Wizard is for the CR-5000 PCB and advanced packaging suite. This land pattern generator is said to reduce the time it takes to build a standard SMT footprint/symbol for a library part; ensures compatibility with the latest IPC standard for surface mount design. The task reportedly takes less than a minute. Consists of land pattern viewers, calculators and generators for the creation of CAD land patterns, including pads, padstacks and footprints/symbols in SMT parts libraries. Dovetails with free IPC library documentation and viewer provided with IPC-7351 standard. Data can be shared with engineers throughout organization on a project-by-project basis.
Zuken, www.zuken.com
PCB Libraries, www.pcblibraries.com
Blindmateable vertical headers have been added to the 4.2 mm PE series connector system. The system is a wire-to-wire, wire-to-board and wire-to-panel connector based on 4.2 mm x 4.2 mm centerlines. Headers are available in even position sizes, ranging from two up to 24. Reportedly can create system where exact positioning of mating connectors is aided by the funnel lead-in of the housing to permit easier alignment and mating in wire-to-board applications. Is available in UL 94V-2 or UL 94V-0 housing materials; contacts are tin-plated or gold-plated brass. Are rated for 9A max. (two-position version) and 600 VAC. Rated for 50 mating and unmating cycles and said to be suitable for intermating and interchanging with competitive products as well as AMP-DUAC connectors.
Tyco Electronics Corp., www.tycoelectronics.com
Press Releases
- NEDME 2025 Draws Strong Northwest Crowd, Builds on Tradition of Regional Collaboration
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- Semi-Kinetics Adds 2nd Pemtron X-Ray Inspection and Component Counting Capabilities as Part of California Expansion
- The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver