Products
PF918-S lead-free BGA spheres is formulated with SnAg4.0Bi3.0 alloy designed with high thermal impact reliability for long service life electronic products with high-reliability requirements.
HCSM2818 resisters are rated at 5W and now provide a 2mΩ resistance value with TCR of 100ppm.
Master Bond EP17TF one-part epoxy has paste consistency and can be dispensed evenly and uniformly.
Press Releases
- SP Manufacturing Brings World-Class EMS Expertise to MD&M East 2025; Jackson Tan Comments
- Aligned Solutions Announces Leadership Transition: Bryce Timms to Succeed Mike Young in Ohio, Kentucky, Western PA; Jim Rittma Comments
- SASinno Americas Expands Product Portfolio with Private-Labeled Purex Fume Extraction Systems; Mike Young Comments
- DISTRON CORPORATION Celebrates 20-Year Anniversary of Test Engineering Manager Richard Guerin