C250 Pb-free wave solder machine is 50" x 30" and handles boards up to 10" wide in its adjustable corrosion-resistant finger conveyor. Is equipped with automatic defluxing, IR preheating, air-knife cooling and a low-volume solder pot. Is available in single or dual wave configurations for through-hole and surface mount assemblies. Includes built-in solder pot loading, a maintenance platform with locking support mechanism and dial-adjustable wave height control.
BlissLift now has a wider base for assembly applications. Reportedly doubles the speed of repetitive load/unload tasks. Permits loading of 19" rackmount chassis into a 19" rack on a shipping pallet; legs straddle the pallet. Is said to be ideal for loading chassis onto storage carts and racks. Lifts loads up to 400 lb. Features easy-to-use controls that help prevent dents and scratches.
CION Module/DIMM240 boundary scan I/O digital module is serially controlled via TAP to CION ASIC chips. Enables testing of all signal and voltage supply pins of JEDEC Std. compliant DIMM240 sockets for DDR2-SDRAM. Is plugged into a respective socket, whereby the interface stages’ voltages are adapted automatically. Several boards of the same or different types can be cascaded in a daisy chain configuration. All channels can be independently switched as Input/Output/Tristate. Provides special safety mechanisms. Is supported by all JTAG/boundary scan controllers of ScanBooster and Scanflex families, as well as the Cascon integrated boundary scan software platform system.