Products
F377 SnPb solder paste is said to have wide print and reflow process windows, and has low sensitivity to humidity. Is no-clean, and voiding exceeds IPC Class 3 in typical applications. Has a reported 8-hr. stencil life.
Heraeus, heraeus-contactmaterials.com/
F555 Water Wash solder paste, for thick-film hybrids, incorporates activators said to be compatible with the glass, resulting in superior adhesion. Comes in Sn62 and Sn63 alloys.
Heraeus, www.heraeus-contactmaterials.com
Japan Unix UM-118 Centrifugal Mixer/Defoamer can be used for solder paste, semiconductor materials, solar pastes, epoxies and other materials. Is programmable for duration, cycle profile and up to 1500 rpm centrifugal speed, as well as internal rotational speed. Mixing of materials and defoaming is said to have cycle times half those of conventional mixers. PC-controllable, and has traceability of every program.
Japan Unix/Christopher Associates, www.christopherweb.com
Japan Unix/Christopher Associates, www.christopherweb.com
