This cleaning system is said to eliminate the need to manually scrape and wipe solder paste from hardware, such as squeegees and misprinted boards, and eliminates the need for saturated wipes. Permits users a “mini-car-wash” type function with push-button activation and no external spraying or chemical exposure. Is hermetically sealed to prevent vapors and discharge of unwanted materials in and around the SMT printer. Re-circulates the cleaning fluid and traps washed solder paste in a catch basin. Is lightweight, compact and portable.
Transition Automation Inc., www.transitionautomation.com
ThQM helps OEMs and EMS firms characterize and verify the reflow or wave soldering process by providing specific checklists of information, including OEM requirements, machine recipe development and thermal profile verification. Helps to identify sensitive components, solder requirements, oven requirements, and other variables. Is said to be the first standardized way to for the OEM and volume EMS firm to approach each job.
ECD, www.ecd.com