Products
BPWin 5.0 software platform has intellectual property protection, featuring BPWin job protection. Enables viewing and editing only with password, and permits full control of programming parameters. Additional features include COM serialization – external serialization server and a free serialization software development kit; process monitoring and control features automation control and supports SPC, verification, auditing and logging; process monitoring permits customer-defined functionality. Has software version control with BPWinLauncher. Device programming features a NAND management utility and data pattern compression. Has JobMaster integrity check, enhanced buffer utilities and an image format tool.
BPM Microsystems, www.bpmmicro.com
Universal holder and blade assemblies are available to fit the following SMT printing equipment: Yamaha, Tenryu-Sieki, Hitachi, Milara, Speed-Print, Samsung, Misuzu and Minami. Feature lightweight design, sliding paste retainers, and flat, secure screw locking of blade. Options include colors (-red, -blue, -green or -silver) and squeegee angle.
Transition Automation Inc., www.transitionautomation.com
Zebra Gold 8000 Series elastomeric connectors reportedly provide excellent board-to-component electrical contact for broad-ranging commercial and military applications. Deliver current carrying capacity of 250-500 mA amps per wire; exhibit electrical resistance of 25-50 milliohms. Are constructed from a low durometer silicone core covered with parallel rows of flat, gold-plated conductors ranging from 100 to 166 wires per inch. Pad spacing as close as 0.020" centers.
Fujipoly America Corporation, www.fujipoly.com
Press Releases
- Seika Machinery’s SMI 2026 Webinar Series Continues with Focus on PCB Cleaning Before Solder Paste Printing
- Forwessun Expands Testing Capabilities through Strategic TRI Alliance
- Federal Electronics Expands Advanced Manufacturing Capabilities to Support Military and Aerospace Cable Assembly and Wire Harness Programs
- Altus Continues Irish Growth with Expansion of Engineering Team