Circuits Assembly Online Magazine - Current Issue

Products

CN-1728 reworkable underfill encapsulant is designed to underfill package-on-package assemblies. Reportedly has a lower coefficient of thermal expansion, higher Tg, and better compatibility with flux residues. Is a fast-flowing capillary underfill with a viscosity of 900 cps; can be cured in as little as 1 min. at 150°C. Is suited for high-volume, high-speed inline processing. Rework is accomplished by use of temperatures between 170°C and 180°C to remove the underfill fillet. Then, the BGA is lifted from the board after heating it to reflow temperature. Underfill residue is easily scraped off.

Zymet Inc. www.zymet.com

The dual-head MC-385 pick-and-place system has IPC-9805 speed of up to 5,500 cph, plus expandability and compatibility features. Is for high-mix, mid-volume assembly. Uses Cognex flying vision and stationary bottom vision. Chip placement capability includes 0201s and flip chips, while AC motor and linear encoder combined with vision, ensure a placement accuracy of ±0.03 mm (±0.001"). Accommodates 64 smart tape feeders; up to 128 feeders are installable in the batch mode. Features high-precision ball-screw X-Y drive and closed-loop servo control with linear encoding.

Manncorp, www.manncorp.com/pick-and-place/mc385

The Model 780 spool valve reportedly provides a higher rate of fluid flow during dispensing. Is designed to accommodate a broader range of fluids, including those possessing high viscosities. Can be integrated into robotics and automated production processes. Has adjustable material suck-back and flow control. Is supplied with hard-coated aluminum components and Teflon seals, and is also available in stainless steel and Teflon construction.

Tridak, www.tridak.com