Products
QX500 AOI has improved cycle times. Now includes SIM, enabling on-the-fly inspection.
SE500-X 3-D solder paste inspection now accommodates boards/panels measuring 100 x 100 mm up to 810 x 610 mm. SE500 and SE500-X 3-D can inspect pad sizes down to 01005.
CyberOptics Corp., www.cyberoptics.com
Extended Reach substrate handling tips are for solar cells, wafers or flat panels. Come in three sizes for reaching up to 200 mm into an area to pick up a substrate. Substrates handled can range from 4" to more than 12". Can be used with any of the firm’s wafer wands. Handle temperatures up to 212°F.
Virtual Industries Inc., www.virtual-ii.com
FlyScan integrates boundary scan and flying probe test methods. Comes on the Pilot/Aerial flying probe testers. Features automatic generation of the test program in a single software environment (Seica VIVA); automatic creation of the boundary scan program for nets not of the JTAG type; automatic elimination of test redundancies; automatic fault diagnostics; a single test report, and management of the faults detected by the boundary scan test in Seica Repair Station.
Seica, www.seica.com
