Circuits Assembly Online Magazine - Current Issue

Products

S3X58-M650 solder paste is an ICT testable, halogen-free SAC 305 alloy. Properties include low voiding, high print speeds, and fine-pitch (µBGA, 0.4 mm pitch) capability.

S3X70-M407 Pb-free no-clean solder paste for ultra-fine-pitch applications uses a Type 5 powder; has been formulated for 0.2 mm pitch (µBGA) devices and 01005 components. Is said to wet in air environments and is low voiding.

Koki Co. Ltd., www.ko-ki.co.jp

GoWave 1030 wave soldering system is for low-volume production for both leaded and Pb-free applications. Is for soldering small- or medium-sizes batches. Now features a longer reflection tunnel over both the preheat area and the solder pot. Has been redesigned as one unit. Features a new spray flux nozzle with HVLP technology. Has a PCS 707 touchscreen controller and USB interface. Service points for the fluxer and compressed air are now located directly at the inlet section of the machine. Features a new switch cabinet and updated pump motor, as well as a redesigned exhaust area and conveyor.

Seho Systems, www.sehona.com

SMT spring-loaded connectors are offered as discrete contacts; many are available in tape-and-reel packaging. Part family 0910-0 and 0910-1 through 4 are discrete SLCs specifically designed for production tape-and-reel assembly. Part 0967 is a horizontal mount SMT SLC designed for low-profile board-to-board interconnections. Feature a large base for either increased PCB stability or assembly in non-PCB applications such as a face plate. Part family 0990-0 and 0990-1 through 4 and 0997-0 through 9 offer a range of application heights from 0.137" to 0.430".

Mill-Max, www.mill-max.com