Circuits Assembly Online Magazine - Current Issue

Products

GenesisSC blends flip-chip assembly capabilities on a Genesis platform. Reportedly provides a complete solution for any production environment. Is tailored for dies and passives placement, including 300 mm wafers. Placement accuracy is said to be ±10 µm @ Cp>1. On-board linear thin film applicator provides dipping capabilities for paste or flux.

Universal Instruments Corp., www.uic.com

LK-G5000 laser displacement sensor comes with RS-CMOS sensor for a 392 kHz sampling rate said to be 8 times faster than previous models, ±0.02% full scale linearity and 0.01 µm repeatability. Is smaller than previous models. Active Balanced Laser Control Engine control is more powerful, and balances laser emission time, laser power, and gain. Dual-port data transfer, using a quad speed clock, enables pixel data to be transferred eight times faster than conventional models, thus simultaneously achieving high-speed and high-resolution. HDE (High Definition Ernostar) lens, together with twice the pixel resolution, results in highly-defined received light wave patterns. Three selectable built in algorithms improve the application solving potential. Perform calculations for up to 12 sensor heads for flatness, warpage and multi-point thickness. Measure speed and acceleration while measuring displacement.

Keyence Corp. of America, www.keyence.com/prlk5

The AIM print test board and kit includes new component technologies: 0.4 and 0.5 mm pitch FusionQuad components, DualRow MLF, 01005 and 0201 resistors, as well as others. Contains BGA and microBGA pads, both having circular and square pad designs to test paste release. Includes the standard IPC slump test pattern. A number on the board indicates the distances between pads. Common pad sizes are incorporated into the layout, including 1206, 0805, 0402, 01005 and 0201 rectangular pads for discrete components; have varying distances between them. Four pads are available for use with various aperture styles to permit wetting tests. Includes several fine-pitch QFP pads.

AIM, www.aimsolder.com