DVD-74C, ESD Control for Electronics Assembly training video provides a thorough explanation of the effects of shrinking geometries, increased performance requirements and lower operating voltages. Provides an overview of ESD physics, including static electricity generation and triboelectric charging. ESD failure models are covered, as are techniques to control ESD, including personal grounding for seated and standing operations, monitoring wrist straps, controlling static charges in the work area, and proper handling, packaging and transporting of ESD-sensitive devices, in accordance with ANSI/ESD S20.20. Includes paper-based or free online testing with certificates of completion for ISO “verification of training.” Also available in online video format, OVT-74C.
IPC, www.ipc.org/DVD-74C
Spectrum S-930N Series of inline dispensing systems are said to improve throughput and material utilization for selectively jetting low-viscosity flux and phase-change high-tack fluxes. Also coats other materials such as polyimides. In conjunction with special valves, enables flux coatings as low as 5 microns. Is said to provide edge definition of 0.5 to 1 mm, minimize flux residue and overspray, and reduce or eliminates cleaning. Software controls flux jetted to accommodate flip chips of varying bump heights. Reportedly capable of jetting virtually any pattern at high speeds.
Nordson Asymtek, www.asymtek.com
Reveal Imager Series improves quality levels of image sensors and camera modules manufacturing assembly in back-end environments. Provides automated inspection for foreign materials and process defects. Has a granite-based gantry; features high-accuracy axes. Detects foreign material sized above 1 to 2 μm, and checks for process defects such as striations, stain, or watermarks, etc. Ensures cleanliness of image sensor before its assembly with the lens module, and detects defects on naked sensors or glass-capped TSV sensors. Inspection can be made at the pixel level or at the top or bottom sides of the capping glass material. Can measure and forward-feed the exact sensor and pixel array positioning (array center X, Y; sensor rotation and tilt) to the lens attach system.
Vi Technology, www.vitechnology.com