Circuits Assembly Online Magazine - Current Issue

Products

EBM soldering iron tips are available in two series. One series is compatible with Hakko’s 900M series of soldering equipment; the other uses Curie Heat Technology. Are 100% tested and offer easy temperature identification. Reportedly have better contact points and tip plating that’s conducive to longer life.

Easy Braid Co., www.easybraidco.com

Correct-A-Chip series Fine Pitch Bump Adapters accommodate pitches down to 0.40 mm. Can use higher pitch devices on smaller pitch boards. Tops have landing pads that can be designed to accept any device on any pitch and settle into fine pitch footprints including TSSOP and QFP with pitches down to 0.40 mm. Bottom has raised connection pads up to 0.010". Integrate higher pitch BGA devices with boards laid out with smaller pitches. Apparatus can operate up to 221°F for FR4 and 266°F for Pb-free. Come in tape and reel. Standard line and trace spacing down to 0.003" can be used. Available in panelized form, adapter only, or with devices mounted.

Aries, www.arieselec.com

Paradigm v.3.7 with a system alerts module is an ERP solution that now includes a plan by MRP function; generates and automates an action list of the required transactions that result after running MRP. Includes a non-nettable raw material processing feature; categorizes raw materials suspected of being defective, so as to not be used in MRP reporting. Various usability and user interface enhancements were also incorporated. The SAM module delivers real-time notifications via mobile device or PC; includes more than 50 alerts regarding sales, production, quality, materials, finance and maintenance; is compatible with Paradigm v.3.4 and higher.

Consona Corp., www.consona.com