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Products

NC258 no-clean solder paste is designed to offer a long pause-to-print window, while enhancing fine print definitions. Reduces voiding and head-in-pillow. Wetting ability results in bright, smooth and shiny solder joints. Offers very low post-process residues, which remain crystal clear after soldering. Is halogen-free and halide-free. Is best used within nine months when stored at 4°C – 12°C, or four months at room temperature. Is available in a variety of packaging.

AIM, www.aimsolder.com

JX-200LED features new algorithms created for the placement of side- and top-view LEDs, rectangular ferrite chip-type and PLCC-type LEDs. Is a placement solution for LED chips in laptop computers, LCD backlights and various lighting equipment. Features an upward looking camera for QFP/QFN lead inspection and BGA ball inspection, as well as 1200 mm board capability with multi-indexing. Designed to support a 31.5" x 14" board size when indexed twice in the machine, and a 47.2" board when indexed three times. Components are rotated 360° in the laser. Supports an automatic tool changer. Can place 15,300 chips per hr. at IPC 9850; supports placement of parts from 01005 to 33.5 mm2. Features an optional tri-colored vision centering system for placing fine-pitch QFPs, BGAs and QFNs.

Juki Corp., www.jukiamericas.com

CO₂ laser marking systems are for marking printed circuit board material and glass, thin film plastics, and organic material. Can mark high-quality text and barcodes directly on FR-4 material, labels or screen-printed areas. Moving parts can be marked inline using “mark on the fly” option. Come in a variety of standard and custom enclosures. Can be tailored to particular application and mark requirements, and feature barcode scan program select, vision corrected marking, motion control and barcode verification. System configurations offer options for loading/unloading and process flow.

Miyachi Unitek, www.miyachiunitek.com