RL132 radial insertion machine has a lead chuck system, providing insertion at 25,700 cph (0.14 sec./component), a reported 33% reduction in printed circuit board transfer time. Supports PCBs up to 650 x 381 mm, four pitch insertion (2.5/5.0/7.5/10.0 mm), and component verification and part binning.
Panasonic Factory Solutions Company of America, www.panasonicfa.com
KFS-VAF volumetric atomized flux applicator is for selective soldering. Controls and dispenses atomized flux material on demand via a user-programmable control system. Does not require any mechanical adjustments. Spray volume and width is set by user-programmed control parameters; varying amounts of coverage can be accomplished as needed on the same printed circuit board. Can be used with all known fluxes, even up to 33% solids. Can be integrated with the KFSDJ drop jet fluxer.
ACE Production Technologies Inc., www.ace-protech.com
SolderStar Pro - VP is for vapor phase reflow profiling. Permits measurement in both standard vapor phase chambers and vacuum applications. Has an ultra-low mass data logger and thermal shield combination. Has minimal influence on the process measurement.
SolderStar Ltd., www.solderstar.eu