Products
M.O.L.E. MAP 3.00 software is designed for machine-assembly-process optimization. Switches from one application to the next, transitioning between wave soldering and reflow processes. Integrates with all ECD profiling hardware. Can use ECD sensor inputs to ECD M.O.L.E. thermal profilers. Start wizards provide step-by-step guidance for new process development, existing process adjustments, data downloads and process verification. Navigation and file sharing enable links to previous sessions, multi-profile sharing through a bulk import feature, and report distribution via PDF or e-mail. Target-10 functionality provides “go/no-go” result indication, intuitive data interpretation, and deep drill-down data. M.O.L.E. and RIDER pairings separate one profiling data acquisition activity from another for environment- and application-specific information.
ECD, www.ecd.com
ScanExpress version 7.7 boundary scan tool suite includes improved constraints handling, support for multi-core devices, and new JTAG Embedded Test support for additional Freescale and Texas Instruments processors. Software improvements include: Separate global and local constraint entry within the ScanExpress TPG preparation GUI; inverted transparency model support along with a new constraint to identify inverted nets; ability to associate multiple BSDL files to a single JTAG device; NAND Flash bad block management support in ScanExpress JET; optimization of STAPL file execution for improved throughput.
Corelis, www.corelis.com
OptiCon THT-Line AOI now can be directly integrated in the production line. Carriers sized up to 620 x 510mm can be fed into the system. PCB inspection area is 540 x 410mm at a component height up to 80mm. Inspects through-hole assemblies, including polarity check of electrolytic capacitors and OCR label reading.
Goepel Electronic, www.goepel.com
Press Releases
- SEMI Applauds Statement from Senators Crapo and Wyden Supporting U.S. Tax Credit for Semiconductor Manufacturing
- ECIA’s July Industry Pulse Sentiment Index Suffers Summer Slide and Dips 12.5 Points from June High
- Datest to Host Siemens EDA Webinar on Data-Driven PCB Test Planning for Increasingly Complex Electronics Designs
- StenTech Expands North American Manufacturing Capacity Through Strategic Investment