Products
A500 benchtop solder paste inspection system automatically finds fiducials, identifies pads, and retains height and volume data for each pad. Shows pads outside thresholds in real-time. Retains historical data. Offers 3-D views, with measurement speeds up to 17 cm²/sec. XY motion permits automatic scanning of PCB panels up to 300 x 300mm. Z-axis motion permits auto-focus of the sensor and board warpage compensation. Accepts Gerber.
VisionMaster, www.visionmasterinc.com
Wizard Stencil Stretch Frame system changed and tensions stencils using simple, adaptable components and readily-available shop air (compressed). Consists of two frame components plus the stencil foil. A patented molded plastic Container Frame holds the stencil foil for handling, mounting, and space-saving storage, using 64 to 80 contact points to hold the foil stencil in place, and protects workers from injuries during handling. When ready to mount for printing, the Container Frame and stencil are mounted in the adjustable, durable, lightweight aluminum frame assembly Stencil tension can be modified in all directions with the amount of air pressure applied. Requires less storage space (since stencil foils can be stored in their compact plastic Container Frames) and eliminates need for epoxy bonding of the stencil foil to a cast frame. Come in three sizes and three types of plastic composition for specific applications.
QTS, Inc., www.QTSframe.com
F05 Poly-forms are flexible pre-shaped adhesives designed for bonding diverse materials, including metals, plastics, and glass. Has negligible vertical flow, keeping the adhesive contained in defined areas. Copolymer prevents drips and dispensing inconsistencies. Adhesive placement is reportedly consistent from bond to bond. Temp. and time required depend on component materials, design, bond requirements, and operating environment. Adding pressure and increasing oven temperature and time improves adhesion. Min. processing temp. is 225°F (107°C). A typical processing schedule is 275°F (135°C) for 10 min. under 5 psi.
Multi-Seals, www.multi-seals.com
Press Releases
- SEMI Applauds Statement from Senators Crapo and Wyden Supporting U.S. Tax Credit for Semiconductor Manufacturing
- ECIA’s July Industry Pulse Sentiment Index Suffers Summer Slide and Dips 12.5 Points from June High
- Datest to Host Siemens EDA Webinar on Data-Driven PCB Test Planning for Increasingly Complex Electronics Designs
- StenTech Expands North American Manufacturing Capacity Through Strategic Investment