Generate Solderpaste Stencil software is available as part of Phototooling Toolbox. Finds components and/or devices on a circuit board, integrates specifications and design rules; makes edits in an automated process. Component library tracks every project, identifying previously encountered components. Edits include automatic home plate, C-shaped and D-shaped pad generation, shifting, shrinking and growing by an amount or percent, heel and toe locking, and independent width and length edits. Edits can be set to round all corners on stencil geometry, set gaps for passive pairs, apply multiple edits with a single click, apply the same edits to standard and associated pads, and apply window-pane belly pad edits. Supported inputs include RS-274X, RS-274D, DXF, DWG, GDSII, ODB++ and DPF.
Infinite Graphics Inc., www.igi.com
Sarcon GR25A-0H2-30GY is a 0.3mm thick, low thermal resistance interface material with a low-tac surface on both sides. Fills air gaps between board components and processors. Transfers heat with a thermal conductivity of 2.8 W/m°K per ASTM D2326 and a thermal resistance of .21°Cin2/W at 14.5 PSI (1.33°Ccm2/W at 100Kpa). Is a flame retardant TIM available in sheets up to 300mm x 200mm. Can be die-cut or trimmed to fit application specifications.
Fujipoly America Corp., www.fujipoly.com
GF-125 HC/HT five-zone horizontal convection reflow soldering oven has longer conveyor length and two additional zones. Has tunnel length of 56". GF series incorporates Horizontal Convection Heating technology; air is circulated horizontally in one direction above the board and in the opposite direction below the board. Compatible with Pb-free solder.
DDM Novastar, www.ddmnovastar.com