Products
The 3D function in the AOI XM camera module has a structured light projector and a multistep laser triangulation procedure; projection is picked up by four or eight side-looking cameras. Has an image acquisition rate up to 1.8GP/sec. Also uses existing angular AOI cameras.
Viscom, www.viscom.com
Solderon BP TS 6000 tin-silver plating chemistry is for use in Pb-free solder bump plating applications. Is capable of plating speeds ranging from 2 to 9µm/min. Has an Ag composition. Is reportedly robust for bumping and capping of patterned wafers; is not restricted to specific photoresists. Exhibits with-in die uniformity after reflow of <5%. Is macro- and micro-void free after reflow. Is electrolytically and thermally stable. Offers electrolytic bathlife of >100 Ah/L and a ≥6-mo. pot life; is compatible with inline metrology processes.
Dow Electronic Materials, www.dowelectronicmaterials.com
Solderon BP TS 6000 tin-silver plating chemistry is for use in Pb-free solder bump plating applications. Is capable of plating speeds ranging from 2 to 9µm/min. Has an Ag composition. Is reportedly robust for bumping and capping of patterned wafers; is not restricted to specific photoresists. Exhibits with-in die uniformity after reflow of <5%. Is macro- and micro-void free after reflow. Is electrolytically and thermally stable. Offers electrolytic bathlife of >100 Ah/L and a ≥6-mo. pot life; is compatible with inline metrology processes.
Dow Electronic Materials, www.dowelectronicmaterials.com
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