Products
OM-535 is a low-temperature solder paste designed to enable a single reflow application for assembly of double-sided printed circuit boards. Has excellent no-solder drip during reflow. With SBX02 alloy and a melting point below 140°C, it has been used with peak reflow profiles between 155°C and 190°C. Flux residue provides excellent electrical resistivity. Eliminates extra wave or selective wave soldering process when temperature-sensitive through-hole components are used. Eliminates need for managing bar solder, wave soldering flux supplies, and pallets. Allows desired obsolescence of an extra SMT process.
Alpha, http://alpha.alent.com/
Has thermal conductivity of more than 10 BTU in/ft2•hr•°F with excellent electrical insulation properties. Is for potting, bonding, sealing and coating applications. Can be used in larger potting applications; has low exotherm when curing. Low coefficient of thermal expansion (CTE), enhanced dimensional stability, a high modulus and superior compressive strength properties.
Master Bond, www.masterbond.com
EP30P two-component epoxy offers adhesion to a variety of substrates. Suitable for bonding glass, polycarbonates and acrylics. Is an electrical insulator. Has low viscosity for encapsulating and potting. Produces high strength, rigid bonds resistant to water, oil, acids and many solvents.
Master Bond, www.masterbond.com
