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PF606-P26 no-clean, halogen-free solder paste is said to prevent BGA non-wet opens and head-on-pillow defects. Is printable, wets and solders well even if BGA components are warped.

Shenmao, www.shenmao.com

EP21NDCL two-component epoxy cures optically clear in thin sections. Has a one-to-one mix ratio by weight or volume. Ratio can be adjusted. Cures at room temp. or more quickly at elevated temp. Upon curing, has durable bonds with high tensile lap shear, tensile and compressive strength of 2,600-2,800 psi, 6,500-7,500 psi and 12,000-13,000 psi, respectively. Volume resistivity greater than 1014 ohm-cm. Resists water, oils, fuels, acids, bases and salts. Withstands thermal cycling over a temp. range of -60° to +250°F. Shelf life of a year at 75°F in original, unopened containers. Comes in container kits ranging from 0.5 pint to 5 gal.

Master Bond, www.masterbond.com

 

XF-731 (1 mil) and XF-732 (2 mil) label materials use a durable top coat chemistry that reportedly is resistant to harsh fluxes. Labels resist softening at elevated temperatures, do not yellow, and exhibit excellent abrasion resistance. Are thermal transfer printable, semi-gloss white polyimide label materials that use acrylic adhesive systems. Are designed to provide barcode tracking of printed circuit boards and electronic components.  

Polyonics, www.polyonics.com


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