Products
SA series automation feeders use SSF feeder technology to enable a range of interface and control capabilities, including ASCII communication protocol, lower profile form factor and optional SAFP robotic interface module for drop-in integration. Reportedly enable more integration flexibility and control options, particularly when smaller form factor or higher level of performance is required.
Hover-Davis, www.hoverdavis.com
Uflex modular automation platform facilitates user-level programming by leveraging a cloud-based library of predefined process strategies. Is built on high-performance base with 2G acceleration, 50μm accuracy and 8μm repeatability. Supports boards up to 630 x 500mm, components up to 38 x 127 x 50mm, and processes including pick-and-place, dispensing, screw driving, labeling, and test handling. Can be integrated into Lean assembly lines or configured inline.
Universal Instruments, uic.com
Flexbond hot bar bonding is for flex circuit applications. Incorporates up to 18 bond heads that are selectively active based on RFID designation of placements. Uses pulse heat technology, closed-loop temp control and programmable pressure settings. Combines with Fuzion for full-process integration, including flux transfer, high-accuracy placement and hot bar soldering.
Universal Instruments, uic.com
Press Releases
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