Products
BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and flip chip assemblies are made using ultra micron technology from highly pure metals. Alloy compositions made using piezoelectric droplet jet technology for accurate diameter uniformity, bright shiny surface finishes and sphericity. Come in diameters of 0.75, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05mm.
Shenmao America, shenmao.com
EP3HTS-LO is a single-component epoxy for bonding, sealing and coating applications. Features silver filler; is electrically conductive with a resistivity of less than 0.001 ohm-cm. Has thermal conductivity of 12-15 BTU•in/(ft²•hr•°F). Is dimensionally stable and bonds well to metals, glass, composites, ceramics and many plastics. Withstands chemicals such as water, oils, fuels and cleaning agents. Is serviceable over the temperature range of -60°F to +400°F. Offers handling with no mixing and an unlimited working life at room temperature. Cure schedule is 45 to 50 min. at 250°F or 20 to 30 min. at 300°F. Passes ASTM E595 tests for NASA low outgassing. Is suited for use in the aerospace, electronics, microelectronics and optical industries.
Master Bond, www.masterbond.com
Mydata Agilis Feeder Repair Set converts any Agilis feeder to any of the four sizes to reduce overall feeder count and maximize production capabilities. Provides one kit for each of the sizes (3.7, 4.0, 4.7, and 5.4) for a single feeder ID. Also includes precision machined aluminum side cover plate with cover tape plow preinstalled; new spring; matching screws for re-assembly. All-aluminum construction provides greater strength and durability. Repairs feeders with broken finger tabs. All components are precision-machined replacements for the original parts. Can be installed onsite.
Count On Tools Inc., cotinc.com
