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Vigon PE 190A PCB and power electronics defluxing agent is an aqueous-based, alkaline cleaning agent. Is based on MPC technology developed for use in spray-in-air equipment. Removes oxidation and stains from copper surfaces, while ensuring material compatibility in preparation for subsequent processes, such as wire/adhesive bonding and molding.

Zestron, www.zestron.com

 

VAC745 and VAC765 vapor phase soldering machines are PC-controlled in combination with a 15" touchscreen. Offer network capability and unlimited program and data storage. Feature modification of program parameters, real-time recording of solder profiles, and targeted data and data management. Integrated IPS Intelligent Profiling System enables users to create a solder profile in one step; PCB temperature is used to control the process. Can influence evacuation time, holding time of the vacuum and venting time. Novel InVapour technology creates a fully inert soldering and vacuum process.

IBL Technologies, www.ibl-tech.com  

 

CondensoX performs reflow soldering by means of hot steam and Galden medium.

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