Products
Tabletop Shadow Moiré (TTSM) warpage metrology system measures warpage of substrates up to 300mm x 310mm (a 300mm wafer or two JEDEC trays).
FH64MA series compact flexible printed circuit (FPC) connector offers a profile of 0.5mm with 0.25mm pitch and depth of 3.15mm when locked.
Press Releases
- Clemsa Achieves up to 75% Faster Changeovers and Higher Quality with Europlacer SMT placement line
- Nordson Test & Inspection to Unveil Next-Generation Inspection and Metrology Technology at SEMICON Taiwan
- AIM Solder Announces New Distribution Partnership with Covermat Co., Ltd. in Thailand
- Automated Production Equipment and Manncorp Announce Strategic Partnership to Expand SMT Solutions for U.S. Electronics Manufacturers