Products
HSI1x instrument for Diamondx platform features 32 transmit lanes and 24 receive lanes with up to 12.8 Gbps data rate.
Loctite Ablestik ABP 8068T die attach materials facilitate package-level sintering and address regulatory challenges of high-lead solders, thermal conductivity drawbacks of conventional die attach pastes, and processability shortcomings of traditional sintering products.
