Products
TurboBoost for eMMC 5.0 and 5.1 devices on the LumenX programming enables improvement of programming performance.
Berquist Gap Pad TGP 6000ULM and 7000ULM thermal interface materials have been formulated with resin platform to deliver ultra-low modulus capabilities and thermal conductivity of 6.0W/m-K and 7.0W/m-K, respectively.
