FlexTRAK-SHS automated plasma treatment system includes 9.6-l (585 in³) large-volume F3-S process chamber that can be configured for larger strips or can treat more strips per cycle, yielding higher throughput and increased productivity for semiconductor and electronics packaging.
EO-Y-005 and EO-Y-006 are water-based hybrid fluxes (with alcohol) are for wave and selective soldering, manual- and repair soldering, and dip soldering.
CV-X series comes with hassle-free software design to find defects, chips, dents, locate parts and inspect the correct assembly.