Products
Berquist Gap Pad TGP 6000ULM and 7000ULM thermal interface materials have been formulated with resin platform to deliver ultra-low modulus capabilities and thermal conductivity of 6.0W/m-K and 7.0W/m-K, respectively.
Camstar Electronics Suite manufacturing execution system (MES) enables printed circuit board (PCB) and box assemblers to meet traceability requirements, improve efficiency levels and control manufacturing operations through direct Internet of Things (IoT) connectivity with machines and production lines.
