News
Electronics manufacturing services provider (EMS) Flextronics (Singapore) is in discussions with Nortel Networks relating to a proposed relationship, whereby Nortel Networks would divest nearly all of its remaining optical, wireless and enterprise manufacturing operations and related supply chain activities to Flextronics.
If discussions are successful, Nortel Networks' Systems Houses activities in Montreal and Calgary, Canada; Campinas, Brazil; Monkstown, Northern Ireland; and Chateaudun, France would be transferred to Flextronics.
Flextronics expects to consolidate and provide full-service supply chain offerings including printed circuit board assembly and fabrication, along with logistics and repair services supported from industrial parks on at least four different continents.
The successful completion of these arrangements would result in Flextronics undertaking and managing in excess of $2 billion of Nortel Networks annual cost of sales. Flextronics anticipates that it would pay Nortel Networks in excess of $500 million in cash over a nine-month period for certain assets.
Copyright 2004, UP Media Group. All rights reserved.
The PL-001-01-XX-0400-32 surface-mount technology heatsink for Dpac and D2pac is now available in a lead free version. The product is based on the placeiT technology that designs, simulates, produces and tapes special mechanical parts for surface mount technology, such as heatsinks, mechanical fixing systems and high current electrical connections for standard and custom applications.
The heatsink is based on the company's special copper alloy with a solderable surface. It is shipped in tape and reel (32 mm), weighs 4 grams and is 6.5 mm high. It is mountable with standard pick-and-place machines using standard nozzles.
The heatsink is placiT technology's first product for the mass marketplace. The company was formed in 2001 to solve a specific customer problem in an economic and automated way. The company is a cooperation of five European companies with experience in mechanics, electronics, magnetics and chemicals.
Copyright 2004, UP Media Group. All rights reserved.
Sanmina-SCI Corp. (San Jose, CA), an electronics manufacturing services (EMS) company, has reported financial results for its first quarter ended Dec. 27, 2003. The company also announced that it will begin searching for a new chief financial officer.
For the first quarter, Sanmina-SCI reported revenues of $2.97 billion, up 9%, from $2.73 billion in the fourth quarter, and up 17% from the first quarter last year.
The company reported adjusted pro forma net income of $26.2 million, or $0.05 adjusted pro forma diluted earnings per share, compared to $14.0 million, or $0.03 per share in Q4, and $6.8 million, or $0.01 per share, for the same period last year. Cash provided by operations was approximately $110 million for the first quarter.
Sanmina-SCI also reported $1.2 billion in cash and short-term investments. At quarter-end, the company reported a current ratio of 1.9, working capital of $2.1 billion and shareholders' equity of $3.3 billion.
Jure Sola, chairman and chief executive officer of Sanmina-SCI, said, "Clearly we are seeing a positive trend across all of our end-markets, orders have been increasing more steadily, and our customers are talking with a more positive and upbeat tone...This quarter, we made further progress in our original design manufacturer (ODM) strategy, adding two design wins for server products with existing original equipment manufacturer (OEM) customers."
The company also announced that its chief financial officer, Rick R. Ackel, will be leaving the company to pursue other opportunities. Ackel has served as CFO since July 2000. Sanmina-SCI will begin a search for a new CFO and in the interim Sanmina-SCI's controller, Mark Lustig, will serve as acting CFO.
Copyright 2004, UP Media Group. All rights reserved.
Press Releases
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Ryder Vietnam - Phase 2: Building resilience and meeting demand
- Scanfil and Etteplan deepen their strategic partnership into production testing