Circuits Assembly Online Magazine - Current Issue

News

Beginning March 1, 2004, Wolf Electronix (Orem, UT), an electronics contract manufacturer (CM), will begin assembly of surface-mount and through-hole components with complete box-build capabilities—including cable harnessing and testing—in Mexicali, Mexico. The 30,000 sq. ft. facility will house the surface-mount and through-hole equipment, along with automated optical inspection (AOI) machinery.

The expansion allows Wolf to reduce labor costs up to 50% on low-mix high-run projects; thus proving an alternative for U.S. companies desiring to keep work in North America while remaining competitive. For the complete box-build, an estimated savings of up to 20% could apply.

Wolf was the first CM in the state of Utah to be awarded an ISO 9002 registration for their quality management system and currently have 9001:2000 registrations at the Utah and Colorado facilities. Wolf now is the first CM headquartered in the state of Utah to expand into Mexico.

"We desire all companies in the U.S. working with a CM to have the overseas labor rates while enjoying closer proximity and ease of communication," said Jim Trent Jr., president of Wolf. " I encourage every company to have the project quoted and compare."

Channels are already in place to facilitate the flow of product from the Mexico facility.

www.wolfelectronix.com

The electronics interconnection group at National Physical Laboratory (NPL, Teddington, UK) is making progress in its current research projects.

The use of AC signals instead of DC in surface monitoring of process residues, such as flux, is yielding startling results. The new methods, dubbed surface insulation impedance (SII), show that some fluxes appear to provide variations in loss of signal in an AC environment orders of magnitude higher than predicted by traditional DC surface insulation resistance (SIR) techniques. Ongoing work continues to validate the findings, which could have important implications for AC circuit reliability. For more information, contact: alan.brewin@npl.co.uk.

Over 170,000 electronic component joints have been built with two isotropic conductive adhesive materials at NPL. These samples are now in seven different accelerated environments comprising damp heat, dry heat and thermal cycling. The next steps will involve analysis of joint conductivity, shear and drop test data to compare the reliability performance of the adhesive joints to that achievable with solder. Contact martin.wickham@ntlworld.com for further information.

Work to improve solderability wetting balance tests by including a pre-heating process for the component is showing significant rewards. The use of pre-heat with focused IR energy allows for a lower solder globule or bath temperature and better representation in the test to the reality of wave of reflow soldering conditions. The improved method is likely to reward users with a better prediction of defect rates if parts are used in production. For more information, contact: alan.brewin@npl.co.uk.

www.npl.co.uk

UP Media Group Inc. (UPMG, Atlanta, GA) has announced the final schedule of events for the thirteenth annual PCB Design Conference West (PCB West). The West Coast conference and exhibition for PCB engineering, design and manufacture professionals will be held March 16-18 in San Jose, CA.

"This year, we've kicked things up a few notches," said UPMG president Pete Waddell. "The complete Professional Development and Technical Conference program boasts a terrific selection of more than 35 courses--over half of which are new to PCB West. Plus, attendees of the full-day tutorials and two-day Design Excellence Curriculum (DEC) courses that make up our new Professional Development Certificate Program will each receive certificates of completion following the show. I'm also pleased to announce that we've added a new low-cost conference package, the Lecture and Workshop Package, which is one of the best bargains we've ever offered at a PCB Design Conference."

The PCB West three-day Technical Conference takes place March 16-17 and includes 27 short courses. The Technical Conference is bracketed by 10 Professional Development Certificate courses: six full-day tutorials and four two-day DEC courses.

Dr. Walden C. Rhines, CEO of Mentor Graphics Corp., will give his keynote address, "Breaking the PCB Design Process," to kick-off the conference on March 16. The exhibition will begin immediately following the keynote. Three special events will also take place back-to-back on March 16: the Opening Night Reception, book signings and the Pot O'Gold Party and Giveaway at the headquarters hotel, the Fairmont San Jose.

Registration for the two-day exhibition and most special events is free.

UPMG publishes Printed Circuit Design & Manufacture and Circuits Assembly, and produces PCB Design Conference West and PCB Design Conference East in the Boston, MA, area. UPMG also hosts the PCB Design Conference Road Series of courses in cities throughout the U.S.