News
Indium Corp. (Utica, NY) has introduced PK-001 and PK-002 flip chip epoxy fluxes designed for use with Sn62 and Sn 63 eutectic solders. The fast curing, halide-free, no-clean fluxes can be used for flip chip or chip-scale package (CSP) soldering processes.
The fluxes have a stable thermoset residue, compatible with standard underfill materials, conformal coatings and most finishes and coatings. They are also environmentally friendly.
Many effective methods can be used to apply the fluxes, such as pin transfer, stencil printing, dispensing or dipping techniques.
Contact Indium Corp. to obtain a copy of the product data sheets.
Indium Corporation is a supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, lead-free solder alloys, underfill materials and die-attach materials.
Copyright 2004, UP Media Group. All rights reserved.
Plexus Corp. (Neenah, WI), a provider of electronic manufacturing services (EMS), has secured an exclusive contract with Patientline PLC to manufacture, supply and install the Patientline bedside multimedia and entertainment system.
The contract gives Plexus sole manufacturing rights over a two-year period and covers the whole of the UK. According to the agreement, Plexus will provide complete product engineering, testing, volume manufacturing and installation services for the bedside units.
The contract also includes Plexus managing the complete supply chain for Patientline from component sourcing to warehousing, logistics, installation and repairs.
The bedside unit has now been installed in over 100 hospitals throughout the UK. It brings TV, telephone, radio, email, Internet and entertainment access direct to the patients' bedside.
Copyright 2004, UP Media Group. All rights reserved.
The VIEW Engineering Inc. (Simi Valley, CA) Pinnacle is a large format non-contact dimensional measurement system for high volume, high capacity operation in production environments ranging from clean rooms to factory floors. Featuring a precision granite base and column, passive vibration isolation system, non-contact stage encoders and linear motors with exceptional acceleration and velocity performance, the system is useful for product design/development and near-line process monitoring applications in advanced manufacturing environments.
The precision metrology system is designed for dimensional measurement applications requiring the highest levels of accuracy and reliability. Its dual-magnification optical system uses two cameras for near instantaneous magnification changes. Multi-color LED illumination systems allow use of monochromatic red, green, blue, or white light for high resolution imaging.
The system features a measuring range of 250 x 165 x 100 mm (xyz) and an accuracy of U2 (xy plane) = (1.5 + 4L/1000) µm and resolution to 0.025 µm.
Applications for Pinnacle include ball grid arrays (BGA), micro-BGAs, chip scale packages (CSPs), flip-chip, multi-chip module (MCM) bump-on-die, lead frames, solder paste and chip carriers. It is electrostatic discharge (ESD) and Class 1000 clean room compatible.
Copyright 2004, UP Media Group. All rights reserved.
Press Releases
- Solderstar to Present Ground-Breaking Reflow Shuttle O2 at SMTconnect 2024
- AAT Installs First Advanced X-40A 4.0 Stencil Cleaner at Jabil in San Jose
- Solder Chemistry to Participate in the Fraunhofer Future Packaging Production Line at SMTconnect
- Absolute EMS Redefines BGA Assembly with State-of-the-Art 4.0 Closed-Loop System Facility