News
AEGIS Industrial Software Corp. (Horsham, PA) and Cogiscan Inc. (Bromont, Quebec, Canada) have announced that they will demonstrate integration between their products as the Cogiscan material tracking and line control technology is integrated to Aegis' real-time machine monitoring and data acquisition systems.
The combined solution offers control of business processes from the preparation of design and bill of matrials data, to line setup validation, execution and the gathering and analysis of process data. It then yields traceability—effectively closing the informational loop. The technical integration creates the first solution offering the Aegis NPI and MES solutions with the materials and process control solutions offered from Cogiscan.
"When Aegis and Cogiscan solutions combine to create closed loop manufacturing control, it yields more than just an extended range of functions," said Jason Spera, chief executive officer of Aegis, "It delivers new depth of information management through the entire process from end-to-end. It is a platform-independent solution free of proprietary and machine-specific elements to make deployment and scalability simple."
Copyright 2004, UP Media Group. All rights reserved.
Universal Instruments Corp. (Binghamton, NY) and CyberOptics Corp. (Minneapolis, MN) have signed an agreement to integrate the new Embedded Process Verification (EPV) inspection technology from CyberOptics into Universal's electronic component placement systems.
Universal will offer the EPV sensor system as a feature on its recently released platform placement machines that incorporate its new placement head. Introduction of the sensor is currently planned for the second half of 2004.
Ian McEvoy, president of Universal, said, "To achieve the challenging quality goal of less than 10 defects per million for surface-mount circuit board assembly, you have to verify each component placement. The CyberOptics' EPV is the first sensing system to enable this within the placement machine."
Steven Case, CyberOptics' chairman and founder said, "Unlike traditional inspection systems that are positioned after the placement machine in an electronics assembly line, EPV puts the inspection process right at the point of action, inside the pick-and-place machine. Ultimately, defects detected by the EPV sensor may be corrected while the circuit board is still within the placement machine."
Universal Instruments is an electronics productivity specialist, providing circuit, semiconductor and back-end assembly technologies and equipment, integrated system solutions and process expertise to manufacturers in every sector of the electronics industry.
CyberOptics Corp., specializing in optical technology, designs and manufactures a growing range of yield and through-put enhancement tools for the surface-mount electronic assembly equipment and semiconductor fabrication equipment markets.
Copyright 2004, UP Media Group. All rights reserved.
Tyco Electronics (Willow Grove, PA), a business segment of Tyco International Ltd., will highlight the Opus 3 Selective Soldering System at this year's upcoming APEX show in Anaheim, CA.
The system is a four-axis Cartesian robot designed for selectively soldering through-hole and odd-form components into surface-mount and mixed-technology printed circuit boards (PCB) from the bottom side without inverting the PCB. It is a completely tool-less system for almost any soldering application.
The system is suited for applications where the product is delivered in small lot quantities and high product mix. The machine also functions well in high speed manufacturing environments when configured with site-specific solder nozzles. The optional tilt axis provides the peel-back found on conventional wave solder systems to insure bridge-free terminations.
The soldering system features the patent pending FlexSite miniature Gaussian solder wave, allowing for a 1-mm keep-out and increased thermal capability. The system features an adjustable board holder, spray fluxer, solder module and vision assist video for set up and process monitoring.
The system is ideal for accessing sites instead of assembly cases or sites shadowed by obstructions. Additionally, topside surface-mount components do not have to be reflowed when soldering only a few joints. The system is configured for bottom-side processing and uses process-specific subroutines for varying thermal demands, such as flow volume, solder temperature, emersion depth, travel speed and dwell. Featuring intelligent spray fluxing, the selective soldering system is designed for pass-through conveyor or batch operation, and is easy to program with instant changeover.
Copyright 2004, UP Media Group. All rights reserved.
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