METHUEN, MA, Dec. 28 -- Infineon Technologies and Parlex Corp. have struck a deal to jointly manufacture and sell substrates for secure mobile electronic identification products. The companies will set up a JV to supply substrates for Infineon's Flip Chip on Substrate program, and to outside customers.
The joint venture will be headquartered in Hong Kong with manufacturing facilities in China. Operations are expected to begin in April.
Under the terms of the agreement, Parlex will have a 51% equity share with Infineon holding the remaining share. Infineon will also pay Parlex $3 million.
Parlex's Shanghai flex circuit plant will also provide certain services which will be paid for by the JV, the companies said.
The electronics manufacturer lowered its fourth-quarter earnings to $5.4 million from $11.5 million. In fiscal 2003, Sanmina-SCI posted a quarterly loss of $85.7 million.
The company also revised its 2004 loss to $11.4 million, about double its earlier reported loss of $5.3 million. Sanmina-SCI reported a loss of $137.2 million in the previous year.
The adjustments were recorded in Sanmina-SCI's fourth quarter and included stock-based compensation charges of $2.4 million, an increase in interest expense of $2 million from certain acquisitions and restructuring charges of $1.1 million.
Sanmina-SCI said adjusted earnings, which exclude unusual items, were not affected by the accounting charge. In October, the company posted adjusted earnings of $41.8 million, and $128.9 million for fiscal 2004
AUSTIN, TX, Dec. 30 -- A dramatic escalation is ahead in device-to-device communication as traffic on the Internet is no longer people talking to people, but people talking to devices and devices talking to devices.
So says self-styled futurist and technologist David Smith, a vice president at Technology Futures Inc., and who has worked with Boeing, Hughes, Intel, Compaq and the CIA.
Other forecasts, as issued by the firm today:
The firm says that in order for these trends to come about, certain policies must be put in place, including an open, standards-based infrastructure that position U.S. organizations as early adapters to information technology developments.