The domestic book-to-bill ratio was 0.96, down from 1.05 in October. November marked the first time the indicator dropped below 1.0 since April 2003, said IPC, which tracks the data.
The ratio is based on data collected by IPC from rigid and flex producers and is calculated by dividing three months worth of orders by sales. A ratio over 1.0 is considered an indicator of rising demand.
Separately, the ratios were 0.88 for rigid PCBs and 1.28 for flexible circuits.
Despite the November dropoff, rigid boards, which are estimated to make up about 82% of all domestic PCBs, are showing some improvement. Year-on-year rigid shipments are up 17.8% and bookings are up 8%, while flexible shipments have grown 72.5% and bookings are up 88.7%.
Combined, shipments and bookings are up 28.5% and 24.8%, respectively, this year. Sequentially, shipments dropped 5.2% and bookings fell 23.3%.
Flex sales include some value-added services in addition to the bare flex circuits.
In a statement, IPC cautioned that month-to-month comparisons should be made with caution as they may reflect cyclical effects.
PLAINVIEW, NY, Dec. 27 -- Aeroflex Inc. said today it received $13.6 million in radio test set orders from the Army, Army National Guard and the Air Force.
Beginning in May, the company will start shipping the sets over a 14-month period.
The order brings the company's military communications orders to $22 million for fiscal 2005. The company booked about $414.1 million in sales in 2004.
Areoflex makes testing and microelectronic products for the aerospace, defense and communications markets.Chrys Shea of Cookson Electronics won for Best of Conference, Alan Donaldson, Intel Corp., won Best of Proceedings, and Lars Boettcher, Fraunhofer IZM Berlin, won Best International Paper.
The awards are chosed by attendees and recipients win $1,000.
Shea was awarded Best of Conference Paper for "Optimizing Stencil Design for Lead-free SMT Processing." The paper identifies optimized stencil aperture geometries and explores the lower spread of lead-free alloys on some alternate surface finishes.
Donaldson's paper, "Hot Air Lead-free Rework of BGA Packages and Sockets," presents rework profiles and a process developed based on actual package reliability tests.
Boettcher's paper, "Development of 3D-Redistribution and Balling Technologies for Fabrication of Vertical Power Devices," which reveeals the development of a 3-D wafer-level redistribution process based on fully additive metal deposition.
The SMTA is seeking papers for its 2005 conference in September. Abstracts will be accepted through Feb. 7 at www.smta.org/smtai/call_for_papers.cfm.