The x-ray group offers manual and automated inspection systems; the rework group manufactures semiautomated and automated rework systems for microBGA, CSP and flip-chip component technologies, including lead-free processing.
The facility is located at 1000 Mount Laurel Circle, Shirley, MA 01464; (978) 425-9446.
The paste reportedly features a stable performance down to 70 µm bump heights (corresponding to 135 µm bump pitches) for a consistent printing process. The stable printing provides consistency of bump height across the wafer as well as from wafer to wafer.
It will operate as part of the newly-expanded COMET China office.
Friedhelm Maur, regional sales manager, and Zoran Zecevic, service engineer, have relocated to Shanghai from the global headquarters in Garbsen, Germany.