News
SAN JOSE -- Tessera
Technologies has filed a patent infringement suit against a pair of leading chip makers.
The filing, which came in U.S. District Court, charges Infineon Technologies and Micron Technology with illegal use of Tessera-patented designs for chip packages that contain memory and other semiconductor devices.
A Tessera spokesman said the company would provide no further details at this time.
Tessera licenses its package designs to other semiconductor makers.
ROCKLIN, CA -- International
DisplayWorks
reported first-quarter revenues increased 85% to $18.1 million, a record, for the period ended Jan. 31.
Gross profit rose 53% to $3.6 million, while net income rose to $1 million.
Gross profit rose 53% to $3.6 million, while net income rose to $1 million.
"We are clearly executing our strategic growth plan, exceeding
previous records for revenue, managing expenses and producing record
profitability," said Tom Lacey, IDW's chairman and chief executive.
IDW guided for second quarter revenue
of $22 million to $23 million.
MINNEAPOLIS -- Alan Rae of NanoDynamics took home the best paper award at January's Pan Pacific Microelectronics Symposium.
Rae's paper, "Nanotechnology and Low Temperature Electronics Assembly," discussed concerns among board assemblers that some components are not - and will not - be ready for lead-free assembly.
He also revealed that assemblers of "exempt" boards -- military, aerospace, and automotive -- are finding that lead-containing components may no longer be available, which will force conversion of these complex boards.
Nanotechnology, Rae says, enables a number of tools which permit lower temperature assembly through enhanced solders, adhesives and novel attachment methods.
The award was selected by attendees of the Pan Pacific Symposium, which is sponsored by the SMTA.
Rae's paper, "Nanotechnology and Low Temperature Electronics Assembly," discussed concerns among board assemblers that some components are not - and will not - be ready for lead-free assembly.
He also revealed that assemblers of "exempt" boards -- military, aerospace, and automotive -- are finding that lead-containing components may no longer be available, which will force conversion of these complex boards.
Nanotechnology, Rae says, enables a number of tools which permit lower temperature assembly through enhanced solders, adhesives and novel attachment methods.
The award was selected by attendees of the Pan Pacific Symposium, which is sponsored by the SMTA.
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