News
BANNOCKBURN, IL -- Just months before the RoHS compliance deadline, IPC and JEDEC are seeking papers for their International Conference on Lead-Free Electronic Components and Assemblies. The conference will be held March 6-8, 2006, in Santa Clara, CA.
Papers from environmental managers and technical staff are sought on any relevant subjects, including:
Policy development policy - European lead ban status
European/Chinese/other legislation or voluntary activity on hazardous materials and recycling
Legislative compliance and policy enforcement methods
Supply chain issues
Standards for marking and testing
Materials declarations, part numbers, obsolescence, etc.
Production issues
Design for lead-free production
Components, solder, board developments, availability and lead-free compatibility
Examples of implementation
Reflow, wave, hand soldering, inspection, repair, rework and test, etc.
Reliability issues
Tin whiskers
High reliability product sectors (automotive, aerospace, etc.)
Reliability test data and method developments
Environmental considerations
Toxicity and risk
Recycling
Hazardous substance substitutes
Research consortia news and updates
Submit a 200-300 word abstract, along with a brief biography, to LFConf@ipc.org by Dec.6.
Papers from environmental managers and technical staff are sought on any relevant subjects, including:
Policy development policy - European lead ban status
European/Chinese/other legislation or voluntary activity on hazardous materials and recycling
Legislative compliance and policy enforcement methods
Supply chain issues
Standards for marking and testing
Materials declarations, part numbers, obsolescence, etc.
Production issues
Design for lead-free production
Components, solder, board developments, availability and lead-free compatibility
Examples of implementation
Reflow, wave, hand soldering, inspection, repair, rework and test, etc.
Reliability issues
Tin whiskers
High reliability product sectors (automotive, aerospace, etc.)
Reliability test data and method developments
Environmental considerations
Toxicity and risk
Recycling
Hazardous substance substitutes
Research consortia news and updates
Submit a 200-300 word abstract, along with a brief biography, to LFConf@ipc.org by Dec.6.
SAN JOSE -- As 2005 draws to a close, it appears the year will have been one of modest growth in the chip industry – despite negative macroeconomic factors such as the price of oil and natural disasters, says market research firm Gartner Inc.
Worldwide semiconductor revenue is forecast to reach $235 billion in 2005, a 6.9% increase from 2004. In 2006, the market is forecast to grow 7.6%, before a mild slowdown in 2007 with growth of 5.1%, according to Gartner.HARRISBURG, PA -- Tyco Electronics’ Global Application Tooling Division (GATD) has established an Automation Technology Center to develop lead-free PCB assembly technologies and RFID inlay assembly processes and systems. The new center, located in Willow Grove, PA, will be led by George Szekely, general manager.
“Our customers face significant challenges in adapting their manufacturing processes to meet the rapidly approaching RoHS deadlines, and the deployment of RFID technologies bring challenges in inlay manufacturing as well,” said Szekely. “For some time we’ve been focusing on lead-free manufacturing processes, and on RFID inlay assembly processes and systems. This new Technology Center will offer our customers leading-edge equipment solutions, process development and prototype short run services.”
The GATD supplies automated equipment and production tooling used in the manufacturing of electronic assemblies.
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