News
EL SEGUNDO, CA – IBM and Microsoft once teamed up to dominate the PC market. Can they make history repeat itself in the video-game console business?
A teardown of Microsoft’s new Xbox 360 Premium video-game console conducted by research firm iSuppli indicates that IBM silicon is a key factor driving the cost and functionality of the product. iSuppli's analysis found the total bill of materials cost for the new Xbox reaches $525, well above the retail price of $399.
A teardown of Microsoft’s new Xbox 360 Premium video-game console conducted by research firm iSuppli indicates that IBM silicon is a key factor driving the cost and functionality of the product. iSuppli's analysis found the total bill of materials cost for the new Xbox reaches $525, well above the retail price of $399.
BRUSSELS -- Members of a task force on classification and
labeling representing EU member states confirmed on Nov. 16 that
Tetrabromobisphenol A (TBBPA) is not subject
to any classification for health. This decision follows the EU human
health risk assessment, completed last May, which concluded that
TBBPA presents no risk to human health.
MINNEAPOLIS -- The SMTA is seeking abstracts for the Third International
Conference and Exhibition on Green Manufacturing and Industry
Development for Electronic Products.
The trade group is seeking papers on green electronic product design and manufacturing, SMT and service adaptability, green materials, retrieving and recycling of waste products and other topics.
The conference will be held May 13-14, 2006, in Tianjin, China.
Abstracts of 200 to 400 words should be submitted by Jan. 30, to SMTA administrator JoAnn Stromberg. It is expected that papers will be presented in Mandarin or with translation.
For full details on submitting an abstract: joann@smta.org.; smta.org/education/education.cfm#call.
The trade group is seeking papers on green electronic product design and manufacturing, SMT and service adaptability, green materials, retrieving and recycling of waste products and other topics.
The conference will be held May 13-14, 2006, in Tianjin, China.
Abstracts of 200 to 400 words should be submitted by Jan. 30, to SMTA administrator JoAnn Stromberg. It is expected that papers will be presented in Mandarin or with translation.
For full details on submitting an abstract: joann@smta.org.; smta.org/education/education.cfm#call.
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- Distron Adds Second Juki Selective Soldering System to Support Growing Production Demand
- Amtech’s New Process Upgrades Elevate Transparency, Speed, and Manufacturing Readiness
- FlashPCB Enhances SMT Production Line with Heller 1809 Reflow Oven and KIC ProBot