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Minneapolis, MN -- The SMTA International Technical Committee is asking for abstracts for the 2006 conference. Short course descriptions are also being solicited.  The deadline for abstracts is Feb. 24, 2006; the SMTA International show  is set for Sept. 24-28 in Rosemont, IL.

Sumit abstracts online here: smta.org/smtai/call_for_papers.cfm.
 
Paper are being solicited in emerging technologies, components, assembly, PCB technology, process control and business issues. Visit the Website for further specifics.

BANNOCKBURN, IL – A group of leading solder vendors today issued a statement asserting “no evidence” exists demonstrating voiding has “any significant impact” on solder joint reliability.

In a statement, Karl Seelig, chair of the subcommittee that issued the report, stressed its findings on Pb- free voids. “Based on the comparison of the number and size of solder joint voids to thermal cycle interconnection failure date, there is no evidence that solder joint voiding has any significant impact on solder joint reliability."

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San Francisco, CA - Design Chain Associates and EPTAC Corp. will continue its one-day seminar series, "Thriving in a RoHS/WEEE Environment," throughout the U.S. in 2006.
 
The seminar will cover the EU directives and add all new information on this continuously evolving issue, including insights into new alloys, explanations of China RoHS, supplier updates, reliability updates and more.
 
This seminar is designed for OEMs, distributors, contract manufacturers and outsource design and manufacturing firms. It is geared toward executive management that needs to determine strategic direction as well as anyone involved in the implementation and execution of the required changes to conform and thrive. Teams are urged to attend since environmental compliance impacts many groups.
 
The course will provide information in seven fundamental areas impacted by the environmental laws, including EU's Thematic Strategies to Japan's new legislation; business environment; resources; business processes; DfE; manufacturing processes; and equipment.
 
Future dates include:
 
San Diego                 February 14
San Jose                  February 16
Boston                     March 7
Atlanta                    March 9
Austin                      April 11
Dallas                       April 13
Minneapolis              May 4
Chicago                   June 8

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